Specifications

A H-1401-SSC8P2-0AN Charging MOS,N-Channel MOS with PNP Transistor DFN 2MM*2MM SSC8P20AN2,AF
67
P H-1401-GJMMMR-4EM
NAND+LPDDR1,1.8/1.8,1Gb/512Mb,25ns/200MHz,16/16,FBGA130,8x9,0.65MM,H9DA1
GG1GJMMMR-4EM HYNIX
PCS 1 U400A H-1401-1AH3E1-NCE
NAND+LPDDR1,1.8/1.8,1Gb/512Mb,25ns/200MHz,16/16,FBGA130,8x9,0.65MM,FS701B
1S1AH3E1NCE FORESEE
A H-1401-D5SBJ5-01A
NAND+LPDDR1,1.8/1.8,1Gb/512Mb,25ns/200MHz,16/16,FBGA130,8x9,0.65MM,FMN1S
D5SBJ-50IA FIDELIX
68 P H-1401-MT6162-000 GSM/GPRS/EDGE/WCDMARF Transceiver,MT6162NMTKPCS1U603
69 P H-1401-MT6276-A00 MTKBaseband chips,MT6276A,13.5MM×13.5MM,515-ball,0.535MMpitch,TFBGAMTK PCS 1 U101
70
P H-1800-FB03RS-BB5 Filter Saw filter,RX Balanced,WCDMA B3/GSM1800,1109,HDFB03RSB-B5，
PCS 1 U605
A H-1800-SK3030-RB0 Filter Saw filter,RX Balanced,WCDMA B3/GSM1800,1109,SK3030RB，SUNTEK
71
P H-1800-FB08RS-BB5 Filter Saw filter,WCDMA B8/GSM900,1109,HDFB08RSB-B5，
PCS 1 U607
A H-1800-SK3080-RB0 Filter Saw filter,WCDMA B8/GSM900,1109,SK3080RB，SUNTEK
72
P H-1200-DTC143-009 Triode,50V,100mA,SOT-523,DTC143ZE
PCS 2 Q500 Q901
A H-1200-TC123J-000 Triode,50V,100mA,SC-89,LDTC123JET1G LRC
A H-1200-DTC123-000 Triode,50V,100mA,SC-89,DTC123JE
73
P N-2103-650525-P07
MICRO USB Socket,After the forward,5PIN,Plain end,0.65PITCH,2.5MMH,7.5x5.5x2.5MMH,HMT-
USB05-5D64-A
PCS 1 J307
A N-2103-AUSB5B-64B
MICRO USB Socket,After the forward,5PIN,Plain
end,0.65PITCH,2.5MMH,7.5x5.5x2.5MMH,ALP-USB5-B64B
A N-2103-650525-T34
MICRO USB Socket,After the forward,No flanging, 5PINS, 0.65PITCH, 2.5MMH,
7.5x5.0x2.5MMH, MIN-205B228
74
P N-2108-JACK06-246
Headphone socket,3.5mm DIA,Bevel,Stereo,Four-part form,6PINAfter the forward,With
positioning column,12.5*6.7*4.66mmH,HMT-JACK06-2D46
PCS 1 J301A N-2108-JCK635-51D
Headphone Socket,Stereo,Four-part form,Bevel,5PIN,DIA3.5MM,With 1 positioning
column,2PCS DIP,12.5*6.7*4.66MMH,ALP-JCK6-3551-D
A N-2108-350547-034
Headphone socket,Stereo,Four-part form,Bevel,5PIN,DIA3.5MM,With 1 positioning
column,2PCS DIP,12.6*6.3*4.7MMH,JAK-006B307-C
75
P N-2116-SIM803-15A
MIRCO SIM Booth,Straight blade,8PIN,2.54PITCH,With 4 grounding
pins,14.15*13.4*1.5MM,ALP-SIMM803-15A
PCS 2 J801 J802A N-2116-815301-608
MICOR SIM Booth,The feed PIN Micro SIMBooth,Ordinary plug and pull type,Center
distance2.54,6PIN,High1.5,外形:14.15*13.4*1.5MM,CAF99-08153-010608,LCN
A N-2116-615008-015
MIRCO SIM Booth,Straight blade,8PIN,2.54PITCH,With 4 grounding
pins,14.18*13.4*1.5MM,HMT-6150008-015M
76
P N-2112-110816-000 T-FLASH Booth,8PINS,PITCH1.1,Lift the cover type,1.6MMH,CAH11-08163-S107 LCN
PCS 1 J803
A N-2112-110816-034 T-FLASH Booth，8PINS Lift the cover type，1.6mmH，CAD-208K240，
A N-2112-TFH815-020 T-FLASH Booth,8PINS,PITCH1.1,Lift the cover type,1.6MMH,ALP-TFH815-02
77
P N-2107-609003-57B
Side-pressing shrapnel battery connector,3PIN,3.0PITCH,With positioning column，
8.4x3.5x5.7mmH,HMT-6090003-57B
PCS 1 CON200A N-2103-BAT130-57A
Side-pressing shrapnel battery connector,3PIN,3.0PITCH,8.4x3.5x5.7MMH,ALP-BAT130-
57A，
A N-2107-300357-A34
Side-pressing shrapnel battery connector,3PIN,3.0PITCH,With positioning column，
8.4x3.5x5.7mmH,BTR-103D256
78 P H-5303-HS5201-000
Shield(BB_V1),Irregular,The
co
pp
er
,
29.3x19.9x1.6mmH
,
HS520 BB CASE V1 20171225
PCS 1
79 P H-5305-HS5201-000
Shield(RF_V1),Rectangle,The copper, 19.7x15.5x1.6mmH,
HS520_RF_CASE_V1_20171225
PCS 1
80 P K-2302-HS5202-001
Mainboard PCB，HS520-MB-V2.0，level 1, 6 layers, 8 panels, no border, material FR4,
panel size :126.89*152.80*1.0MM
PCS 1
P H-0602-05FC8A-A00
Chip capacitor,0.5pF,±0.25pF,50V,COG,0201,T=0.3MM,C0201COG0R5C500NTA
EYANG