Specifications

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Specifications
Specifications are subject to change without notice.
Table 6. Specifications
Criteria Specification
Bandwidth/Distance Up to 44.736 Mbps per DS3 port
ETHX-2214-DS3: Up to 44.736 Mbps
ETHX-2224-DS3 Up to 89.472 Mbps using loop bonded DS3 circuits
Dimensions 1.9" x 8.6" x 6.75" (H x W x D)
4.8 cm x 21.7 cm x 17.1 cm (H x W x D)
Interfaces ETHX-2214-DS3: Two (2) BNC 75 ohm jacks (Tx and Rx)
ETHX-2224-DS3: Four (4) BNC 75 ohm jacks (2-Tx and 2-Rx)
Four (4) 10/100BaseT RJ45
Operating Environment Temperature: -40°F to 158°F (-40°C to 70°C)
Non-operating temperature: -40°F to 158°F (-40°C to 70°C)
Humidity: 5% to 95%, non-condensing
Altitude: –200 ft to 16,500 ft (–60 m to 5,000 m)
Power ETHX-2214-DS3: –48 VDC, 0.2 A, 10 W
ETHX-2224-DS3: –48 VDC, 0.3 A, 15 W
Protocols Supported Transparent 802.1D Bridging
DS3 Line Code: unframed and unchannelized DS3 only
(M13 and C-Bit DS3 Framing formats are not supported)
Regulatory Compliance EMC: FCC Part 15 Class A, ICES-003
Safety: ANSI/UL 60950-1, CAN/CSA C22.2 No. 60950-1-03,
IEC 60950-1:2001, EN 60950-1:2001
Standards Supported NEBS Level 1
GR-063-CORE & GR-1089-CORE
IEEE 802.3 Ethernet
IEEE 802.1p Priorities
IEEE 802.1Q VLAN
Weight 1.0 lbs (0.45 kg)