EFM PRODUCT GUIDE Copper-Based Ethernet in the First Mile Zhone Technologies
Ethernet Everywhere ••• Need high-bandwidth Ethernet service over existing copper? Zhone’s EFM Solutions make it easy and cost-effective. Ethernet loop bonding delivers high-bandwidth services without the cost of fiber construction. With more than 85% of all US businesses served by copper today, Ethernet in the First Mile (EFM) loop bonding has seen a 65% CAGR, the highest growth rate in telecommunications.
Bonding copper circuits for increased Ethernet bandwidth Grande Communications Makes Carrier Ethernet a Big Success “ The addition of Zhone’s Ethernet access technology in combination with Grande’s extensive copper and The key innovation in EFM is the loop bonding of multiple copper circuits to provide fiber network creates an unparalleled increased bandwidth. By intelligently distributing traffic across multiple circuits, delivery vehicle.
Access Devices (EADs) Category •Product •• Ethernet Easy, Proven, Deployed World’s most proven line of EADs 4 or 8 SHDSL.bis 5.7 Mbps WAN ports and 4 Ethernet LAN ports 1 or 2 SHDSL.bis 5.7 Mbps WAN ports and up to 2 Ethernet LAN ports EtherXtend EtherXtend LT EtherXtend is a high capacity EAD capable of bonding up to 8 SHDSL.bis copper lines for up to 45.6 Mbps of bandwidth. EtherXtend supports both 802.3ah EFM interface and OAM standards, as well as existing HDLC-based Ethernet over copper bonding.
Product Category Ethernet Access Device Selection Guide EtherXtend Family Network Extenders EtherXtend EtherXtend LT EtherXtend LT DS3 TNE ENE SNE SHDSL.bis 5.7 Mbps SHDSL.bis 5.7 Mbps DS3 45 Mbps T1 1.544 Mbps E1 2.048 Mbps SHDSL 2.3 Mbps 4 or 8 1 or 2 1 or 2 1, 2, 4 or 8 1, 2, 4 or 8 1, 2 or 4 Bandwidth (at max ports) Up to 45 Mbps Up to 11.4 Mbps Up to 90 Mbps Up to 12 Mbps Up to 16 Mbps Up to 9.2 Mbps Loop Bonding 802.
••• EFM Aggregation Versatile multi-service access and aggregation over copper and fiber MALC-EFM 319, 719, 723 The MALC is a full featured Layer 2 and 3 multi-service access platform. Using a common chassis, uplink and commons, MALC-EFM serves as an Ethernet aggregation access platform supporting SHDSL.bis (5.7 Mbps) or T1 / E1 bonding from 24-port line cards. Network timing and networking powering line card options are also available.
Aggregation Platforms 8800 / 8620 DSLAM MALC-EFM Line Card* MALC-EFM- MALC-EFMSHDSL-24* T1 / E1-24 8986-B1-000 IPD 4000 / 12000 DSLAM ESIM5700-48 SIM2000-24 TIM1500-24 EIM2000-24 SHDSL.bis 5.7 Mbps T1 / E1 SHDSL.bis 5.7Mbps SHDSL.bis 5.7 Mbps SHDSL 2.3 Mbps T1 E1 Loop Bonding 802.3ah, HDLC EFM, HDLC 802.
Access for a Converging World North America Corporate Headquarters Canada Zhone Technologies @ Zhone Way 7001 Oakport Street Oakland, CA USA 94621 +1 510 777 7000 Tel. Zhone Technologies Canada 30 Winners Circle Toronto, Canada M4L 3Z7 +1 416 543 4627 Tel. Europe, Middle East and Africa (EMEA) Regional Headquarters United Kingdom Zhone Technologies S.r.l. Segrate (Milan), Italy +39 02 75399201 Tel. Zhone Technologies Ltd. UK London, England +44 01962 734555 Tel.
