Data Sheet
Manuals
Brands
Zhejiang Rexense IoT Technology Manuals
Electronics
Zigbee module
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Table Of Contents
1. Production Introduction
1.1 Introduction
1.2 Application
1.3 Main Characteristics
1.4 Product Advantage
1.5 Abbreviation
1.6 Related documents
2. Product Overview
2.1 Overview
3. Technical Specification
3.1. Electrical Specification
3.1.1. Electrical Specification
3.1.2. Test Conditions
3.1.3. RF Electrical Characteristics
3.1.4. Processor Characteristics
3.1.5. Module Interface Characteristics
3.2. Physical/Ambient Characteristics
3.3. Pin Configuration
3.5. Test Result of RF Performance
3.6. Soldering Temperature for Module
3.7. Packing Layout Of Module
Blank=Normal 85℃（Default）
Ｉ=Industrial Application(Version for Hi-temp）
5. Contact Us
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17
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Figure
3-1
9.
T
est
of
Modu
lation
Sig
nal
3.6.
Soldering
Temp
erature
for
Module
The
max
temperature
for
solde
ring
module
sh
all
be
within
237-2
45℃
in
20s
.
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