Specifications
Manuals
Brands
Zhejiang Lierda Internet of Things technology Manuals
Electronics
Bluetooth Module
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Table Of Contents
1 Specifications & Parameters
2 Dimensional Drawing and Pin Definitions
2.1 Dimensional Drawing
2.2 Pin Definitions
3 Basic Operations
3.1 Pins
3.2 Notices to Hardware Layout
3.3 Antenna Clearance
4 Common Problems
4.1 Communication Failure of Module in Near Distan
4.2 Abnormal Power Consumption of Module
4.3 Insufficient Communication Distance of Module
4.4 Module Authentication
5 Production Guide
5.1 Production Guide
5.2 Requirements on Module Position on Bottom Plat
5.3 Opening Design of Steel Mesh
5.4 Standard Operation Procedure (SOP) of Reflow
6 Packaging
6.1 Packaging Material
6.2 Package Siz
6.3 Packaging Direction
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5.4
Standar
d
Oper
ation
Procedure
(SOP)
of
Reflo
w
Solde
ring
Note:
This
Standard
Operation
Proced
ure
(SOP)
is
only
applicab
le
to
le
ad-free
opera
tion
and
for
referenc
e
only
.
Fig.
5-1
Standard
Operation
Proced
ure
(
SOP)
of
Reflo
w
Soldering
1
...
...
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12
13
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