User's Manual

13
the land after more than 3 months, and may lead to such problems as false welding and
missing welding during the mounting process.
In order to ensure the pass rate of reflow, it is suggested picking 10% of products for visual
inspection and AOI detection in the first time of mounting, so as to ensure the
reasonableness of the furnace temperature, device absorption method and placement
method;
Operators at all stations must wear the anti-electrostatic gloves during the whole production
process;
5.2 Requirements on Positions of Module on Backplane
It is suggested the green oil thickness at the module position of the backplane be less than
0.02mm, so as to prevent the phenomenon that the green oil is too thick, the module is
blocked up and cannot be effectively contacted with solder paste, and the welding quality is
affected.
In addition, please do not place other devices within 2mm around the module position on
the interface board, so as to ensure the convenience for repairing the module.
5.3 Opening Design of Steel Mesh
The thickness of the stencil on the backplane shall be selected by comprehensively
considering the packaging type of the devices in the board, and special attention shall be
paid to the following requirements:
The land position of the module can be locally thickened to 0.15~0.20mm, so as to prevent
void solder;