User's Manual

12
4.3 Notices
1. Power Supply
It is suggested supplying power to the module with DC regulated power supply. The ripple
of power supply should as small as possible. Usually the ripple is less than 30 mV.
Excessive ripple will lead to poor sensitivity and other connection abnormalities. At the
same time, the transmitting signal of Bluetooth will be coupled into the interference signal,
which will cause the radio frequency to exceed the Bluetooth specification, and even will
result in failed connection and communication. It is recommended to use LDO as power
supply for the module. At the same time, LDO should be far away from DC-DC power
supply and inductance to prevent DC-DC radiation from polluting LDO power supply. The
module should be grounded reliably, and pay attention to the correct connection of the
positive and negative poles of the power supply, and reverse connection may cause
permanent damage to the module.
2. Electro-static discharge notices
The user shall pay attention to the electrostatic requirements (as shown in Table 2-1) of the
product, and add the electrostatic prevention measures when designing the end products.
Chapter 5 Production Guidance
5.1 Production Guide
It is suggested the stamp hole packaging module mounted by an SMT machine, and the
mounting shall be finished within 24 hours after unpacking. Otherwise, its need to
repackage by vacuumizing, so as to prevent poor mounting effect due to damp.
If the package includes a humidity indicator card, it is suggested judging if the module
needs to be baked according to the indication of the humidity indicator card. The baking
conditions are as follows:
Baking temperature: 125℃±5℃;
The alarm temperature is set to be 130℃;
SMT mounting can be carried out after the temperature cools down to be <36℃ under
natural conditions;
If the product is unpacked for over 3 months, please pay special attention if the product is
affected with damp, because the PCB gold immersion process may lead to the oxidation of