User's Manual

Page
16
of
18
Lierda Science &
Technology Group
Securities
Securities
Securities
Securities Code
Code
Code
Code
IoT
IoT
IoT
IoT Interconnection,
Interconnection,
Interconnection,
Interconnection, Smart
Smart
Smart
Smart Life
Life
Life
Life
Lierda Science & Technology Group
Chapter
Chapter
Chapter
Chapter 6
6
6
6 Product
Product
Product
Product Package
Package
Package
Package
6.1
6.1
6.1
6.1 Packaging
Packaging
Packaging
Packaging Method
Method
Method
Method
■ Tape □ Foam □ Electrostatic bag
6.2
6.2
6.2
6.2 Strip
Strip
Strip
Strip Size
Size
Size
Size
6.3
6.3
6.3
6.3 Product
Product
Product
Product Direction
Direction
Direction
Direction
The placement direction of the tape packaging module is as shown in the following figure:
Technical
Requirement 1
Reference Size
Technical Requirements:
1. The accumulative error of every 10 driving holes shall be within ± 0.2;
2. The side bend within 250MM must be no more than 1;
3. Material of carrier tape: Black PS, thickness: 0.30 ± 0.05;
4. The surface impedance is from 10
6
to 10
11
ohm;
5. Each roll is packed by a 21m 13 ’’ plastic tray, and can contain 1000 Pcs
elements
6. A0 and B0 shall be measured at 0.3mm upwards at the bottommost of the
inner side of the die cavity, and K0 refers to the inner depth. The unmarked R
angle is 0.3
7. The product meets the standard EIA-481;
8. The product is required to meet “ ROHS ” ;
Ver
sion
Revision Contents
Date
Client No.: LSD4BT-E66ASTD001