User's Manual

Page
15
of
18
Lierda Science &
Technology Group
Securities
Securities
Securities
Securities Code
Code
Code
Code
IoT
IoT
IoT
IoT Interconnection,
Interconnection,
Interconnection,
Interconnection, Smart
Smart
Smart
Smart Life
Life
Life
Life
Lierda Science & Technology Group
requirements:
The land position of the module can be locally thickened to 0.15~0.20mm, so as to prevent void
solder;
5.4
5.4
5.4
5.4 Standard
Standard
Standard
Standard Operation
Operation
Operation
Operation Procedure
Procedure
Procedure
Procedure (SOP)
(SOP)
(SOP)
(SOP) for
for
for
for Reflow
Reflow
Reflow
Reflow
Note: This SOP is only applicable to lead-free operation, and only for reference.
Approved
by
Revie
wed
by
Gener
ated
by
Gener
ation
Date
Reflow
Operation
Items
Curve
Chart
Tempe
rature
Zone
Param
eters
Curve
Param
eters
Peak temperature
Soaking
temperature
Tin fusion
temperature
Slope of
increase
Slope of reflow
Slope of cooling
Specificat
ion
Material
No.
Used
Amount
位号
Tool/Equipment
Used
Amount
No Date
Revision Contents
Thermometer
Thermometric plate
High temperature-resistant
gloves