User's Manual

Page
14
of
18
Lierda Science &
Technology Group
Securities
Securities
Securities
Securities Code
Code
Code
Code
IoT
IoT
IoT
IoT Interconnection,
Interconnection,
Interconnection,
Interconnection, Smart
Smart
Smart
Smart Life
Life
Life
Life
Lierda Science & Technology Group
It is suggested the stamp hole packaging module mounted by an SMT machine, and the mounting
shall be finished within 24 hours after unpacking. Otherwise, its need to repackage by vacuumizing, so as
to prevent poor mounting effect due to damp.
If the package includes a humidity indicator card, it is suggested judging if the module needs to be
baked according to the indication of the humidity indicator card. The baking conditions are as follows:
Baking temperature: 125 ℃ ± 5 ℃ ;
The alarm temperature is set to be 130 ℃ ;
SMT mounting can be carried out after the temperature cools down to be <36 ℃ under natural
conditions;
If the product is unpacked for over 3 months, please pay special attention if the product is affected
with damp, because the PCB gold immersion process may lead to the oxidation of the land after more than
3 months, and may lead to such problems as false welding and missing welding during the mounting
process.
In order to ensure the pass rate of reflow, it is suggested picking 10% of products for visual inspection
and AOI detection in the first time of mounting, so as to ensure the reasonableness of the furnace
temperature, device absorption method and placement method;
Operators at all stations must wear the anti-electrostatic gloves during the whole production process;
5.2
5.2
5.2
5.2 Requirements
Requirements
Requirements
Requirements on
on
on
on Positions
Positions
Positions
Positions of
of
of
of Module
Module
Module
Module on
on
on
on Backplane
Backplane
Backplane
Backplane
It is suggested the green oil thickness at the module position of the backplane be less than 0.02mm, so
as to prevent the phenomenon that the green oil is too thick, the module is blocked up and cannot be
effectively contacted with solder paste, and the welding quality is affected.
In addition, please do not place other devices within 2mm around the module position on the interface
board, so as to ensure the convenience for repairing the module.
5.3
5.3
5.3
5.3 Opening
Opening
Opening
Opening Design
Design
Design
Design of
of
of
of Steel
Steel
Steel
Steel Mesh
Mesh
Mesh
Mesh
The thickness of the steel mesh on the backplane shall be selected by comprehensively considering
the packaging type of the devices in the board, and special attention shall be paid to the following