8812CU3 User Manual
(Top View) Module Name: Module Type: 802.11ac 867Mbps 2T2R WiFi USB Module Revision: V1.0 Customer Approval: Company: Title: Signature: Date: BL-link Approval: Title: Signature: Date: Revision History Revision 1 Summary Release Date 0.1 Initial release 2020-05-20 1.0 Official release (change product picture) 2020-06-24 http://www.b-link.net.
1. Introduction 8812CU3 is a highly integrated 2*2 dual-band wireless LAN module. It combines a WLAN MAC, a 2T2R capable WLAN base band，a dual-band WLAN radio. It supports IEEE 802.11a/b/g/n/ac standard and provides the highest PHY rate up to 867Mbps, It can offer feature-rich wireless connectivity and reliable throughput from an extended distance. 1.1 Features Operating Frequencies: 2.4~2.4835GHz and 5.15~5.85GHz Host Interface is USB2.0 IEEE Standards: IEEE 802.
Power Supply VDD 3.3V±0.2V @850mA Max Operation Temperature -20℃ to +70℃ Operation Humidity 10% to 95% RH (Non-Condensing) 2. Pin Assignments (Top View) 2.1 Pin Definition No Pin Name Type Description 1 GND RF RF Ground 2 NC RF NC (Reserved for 2.4/5G-ANT1) 3 GND RF RF Ground 4 GND RF RF Ground 5 NC RF NC (Reserved for 2.4/5G-ANT0) 6 GND RF RF Ground 7 LED O 8 GND P Ground 9 DP+ I/O USB 2.0 differential pair VDD 10 DM- I/O USB 2.
Module (Active Low, internal pull high by 47K resistor) IPEX0 2.4/5G-ANT0 RF 2.4G / 5G RF to IPEX connector for ANT0 IPEX1 2.4/5G-ANT1 RF 2.4G / 5G RF to IPEX connector for ANT1 P: Power, I: Input, O: Output, I/O: In/Output, RF: Analog RF Port 3. Electrical and Thermal Specifications 3.1 Recommended Operating Conditions Parameters Min Typ Max Units Ambient Operating Temperature -20 25 70 ℃ 1.7 2 3.1 3.3 3.
2.4G 11Mbps RX (RF-Test，1RX) 200 250 mA 2.4G 6Mbps TX (RF-Test，1TX) for 16dBm 330 370 mA 2.4G 6Mbps RX (RF-Test，1RX) 200 240 mA 2.4G 54Mbps TX (RF-Test，1TX) for 16dBm 240 270 mA 2.4G 54Mbps RX (RF-Test，1RX) 200 230 mA 2.4G MCS15(HT20) TX (RF-Test，2TX) for 16dBm 270 310 mA 2.4G MCS15(HT20) RX (RF-Test，2RX) 210 230 mA 2.4G MCS15(HT40) TX (RF-Test，2TX) for 16dBm 255 285 mA 2.4G MCS15(HT40) RX (RF-Test，2RX) 220 260 mA 5.8G 6Mbps TX (RF-Test，1TX) for 16dBm 390 430 mA 5.
Frequency Range 2.4~2.4835GHz (2.4GHz ISM Band) Channels Ch1~Ch11 (For 20MHz Channels) 802.11b (DSSS): DBPSK, DQPSK, CCK; Modulation 802.11g (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11b: 1, 2, 5.5, 11Mbps; 802.11g: 6, 9, 12, 18, 24, 36, 48, 54Mbps; Date Rate 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps; 802.11n (HT40): MCS0~MCS7(1T1R_SISO) 13.5~150Mbps; 802.
Frequency Range Channels 5.15~5.25GHz; 5.25~5.35GHz; 5.47~5.725GHz; 5.725~5.85GHz (5GHz ISM Band) Ch36, Ch40, Ch44, Ch48; Ch52~Ch64; Ch100~Ch140; Ch149~Ch165 (For 20MHz Channels) 802.11a (OFDM): BPSK, QPSK, 16QAM, 64QAM; Modulation 802.11n (OFDM): BPSK, QPSK, 16QAM, 64QAM; 802.11ac (OFDM): BPSK, QPSK, 16QAM, 64QAM, 256QAM; 802.11a: 6, 9, 12, 18, 24, 36, 48, 54Mbps; 802.11n (HT20): MCS0~MCS7(1T1R_SISO) 6.5~72.2Mbps; 802.11n (HT20): MCS8~MCS15(2T2R_MIMO) 13~144.4Mbps; 802.
802.11n@HT20_MCS7 16dBm ±2dBm ≦-28dB 16dBm ±2dBm ≦-10dB 16dBm ±2dBm ≦-28dB 16dBm ±2dBm ≦-30dB 16dBm ±2dBm ≦-32dB 802.11ac@VHT80_MCS0 14dBm ±2dBm ≦-10dB 802.11ac@VHT80_MCS9 14dBm ±2dBm ≦-32dB 802.11ac@VHT20_MCS7 802.11n@HT40_MCS0 802.11ac@VHT40_MCS0 802.11n@HT40_MCS7 802.11ac@VHT40_MCS7 802.11ac@VHT20_MCS8 802.11ac@VHT40_MCS8 802.11ac@VHT40_MCS9 5G Receiver Specifications (Ant0/Ant1) RX Rate Min Input Level(Typ) Max Input Level(Typ) PER 802.11a@6Mbps -90dBm -10dBm < 10% 802.
5. Mechanical Specifications 5.1 Module Outline Drawing (Top View) Module dimension: 27.0mm*17.8mm*3.1mm （L*W*H , Tolerance: ±0.15mm） IPEX connector dimension: 2.6*3.0*1.2mm (L*W*H, Ø2.0mm) 9 http://www.b-link.net.
Module Bow and Twist：≤0.1mm 5.2 Mechanical Dimensions (Top View) (Bottom View) 10 http://www.b-link.net.
6. Application Information 6.1 Typical Application Circuit BL-M8812CU3 Module Crystal 2.4/5G Ant0 2G RF Diplexer 5G RF Ant1 2G RF Diplexer 5G RF Dual Band RTL8812CU Host LED PDN USB_DP USB_DM GND VDD3.3V Controller USB2.0 Host Power DC-DC 6.2 Recommend PCB Layout Footprint (Bottom View) 11 http://www.b-link.net.
6.3 Reflow Soldering Standard Conditions Please use the reflow within 2 times. Set up the highest temperature within 250℃. 7. Key Components Of Module No. Parts Specification Manufacturer 1 Chipset RTL8812CU-CG Realtek Note Shen Zhen Tie Fa Technology limited 2 PCB BL-M8812CU3 MILLION SOURCE PRINTED CIRCUIT BOARD CO., LTD Quzhou Sunlord Electronics Co., Ltd HUBEI TKD ELECTRONICS TECHNOLOGY CO., LTD. 3 Crystal 40MHz-10pF-10ppm-3225 LUCKI CM ELECTRONICS CO., LTD HOSONIC ELECTRONIC CO., LTD.
8. Package and Storage Information 8.1 Package Dimensions Package specification: 1. 700 modules per roll and 2,800 modules per box. 2. Outer box size: 37.5*36*29cm. 3. The diameter of the blue environment-friendly rubber plate is 13 inches, with a total thickness of 48mm (with a width of 44mm carrying belt). 4. Put 1 package of dry agent (20g) and humidity card in each anti-static vacuum bag. 5. Each carton is packed with 4 boxes. 13 http://www.b-link.net.
8.2 Storage Conditions Absolute Maximum Ratings: Storage temperature: -45℃ to +85℃ Storage humidity: 10% to 95% RH（Non-Condensing） Recommended Storage Conditions: Storage temperature: 5℃ to +40℃ Storage humidity: 20% to 90% RH Please use this Module within 12month after vacuum-packaged. The Module shall be stored without opening the packing. After the packing opened, the Module shall be used within 72hours.
This modular complies with FCC RF radiation exposure limits set for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and the user's body. The device is going to be operated in 5150~5350MHz frequency range. It is restricted indoor environment only.
