User`s manual

BL160086 s Prototyping Board
GND
+5 V
+15 V
–15 V
GND
+5 V
+15 V
–15 V
(a) GND and 5 V on Top Side
(b) +15 V and 15 V on Bottom Side
Figure C-4. BL1600 Prototyping Board Connections
Among Adjacent Pads
Figure C-5. DIP Placement Along Power Rails
If you look closely at the top side of the board, you will note that some
pads are connected to adjacent pads. This pattern is laid out with DIP
placement in mind. You can place either 300-mil or 600-mil DIPs in many
different positions and still have DIP pins connected to the adjacent pads.
This makes it easy to connect them to other components. For a standard
300-mil DIP, a power rail fits in between its two rows of pins; for DIPs
600 mils in width, two power rails fit between its pins. This arrangement
gives the DIPs easy access to the different operating voltages.
Figure C-4 illustrates this arrangement.
Figure C-5 shows the top left part wired to a ground pad through an
adjacent connected pad. The middle part is wired to +5 V. The larger part
on the right is wired to +15 V.