Datasheet

Chip Resistor Surface Mount
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ww.yageo.com
Feb. 05, 2013 V.6
Product specification
8
9
SERIES
RC
0603 (RoHS Compliant)
TEST TEST METHOD PROCEDURE REQUIREMENTS
Intermittent
Overload
IEC 60115-1 4.39
2.5 times of rated voltage or maximum
overload voltage whichever is less for 1 second
on and 25 seconds off; total 10,000 cycles
±(1.0%+0.05 Ω) for 1%,
0.5% tol.
±(2.0%+0.05 Ω) for 5% tol.
<100 mΩ for Jumper
Solderability
- Wetting
IPC/JEDEC J-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
1
st
step: method B, aging 4 hours at 155 °C
dry heat
2
nd
step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching
IPC/JEDEC J-STD-002B test D
Leadfree solder, 260 °C, 30 seconds
immersion time
No visible damage
- Resistance to
Soldering Heat
IEC 60068-2-58
Condition B, no pre-heat of samples
Leadfree solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
±(0.5%+0.05 Ω) for 1%,
0.5 tol.
±(1.0%+0.05 Ω) for 5% tol.
<50 mΩ for Jumper
No visible damage