Datasheet

The working temperature of solder is detailed below and can vary from manufacture
to manufacture.
Melting point 220℃(428℉)
Normal operation 300-360℃ (572-680℉)
Production line operation 360-410℃ (680-770℉)
IMPORTANT: The temperature above 410℃ (770℉) is not recommended for
normal soldering functions, but can be used for short periods of time when high
temperatures are required. Please note that the lead free solder alloys require a higher
soldering temperature which shortens tip life.
COMMON CAUSES OF TIP UNWETTING
1. Tip temperature higher than 410℃ (770℉).
2. The tip working surfaces are not well tinned while the iron idling.
3. Lack of flux in soldering, wicking, repairing, and touch-up, etc operation.
4. Wiping tip on a high sulphur content sponge, dirty or dry sponge and/or rage.
5. Touching with organic, such as plastic resins, silicone grease and other chemicals.
6. Impurities in solder and low tin content.
CARE OF TIPS
Ca Caution: The soldering iron can reach very high temperature. Be sure to trun the
unit off prior to carrying out any maintenance or trouble shooting steps listed below.
IMPORTANT - Remove the tip and clean after every usage or at least once a week.
Remove any loose build up in the tip retaining assembly to prevent tip freezing. The
solder tips supplied are iron clad pure copper and if used properly will give a long
life.
1. Always keep tips tinned before returning to the holder, switching off or storing for
any period of time. Wipe only before using.
2. Don’t keep iron set at high temperature for long periods of time as this will break
down the surfaces of the tip.
3. Don’t give any excessive pressure on a tip or rub a tip on a joint. It does not
improve the heat transfer but only damages the tip.
4. Never clean the tip with abrasive materials or a file.
5. Don’t use a flux containing chloride or acid, use only rosin or activated resin
fluxes.
6. If any oxide does form, it can be cleaned by lightly rubbing with a 600-800 grit
emery cloth, isopropyl alcohol or equivalent, then wrap rosin-core solder around
the newly exposed surfaces and heat, flood the tinned areas with rosin-core solder
after wrapped rosin-core solder melted.