Specifications

3.1
发射管晶圆尺寸
Launch tube
wafer size
发射管芯片尺寸。不小于12mil。
Launch tube chip size. Not less than 12 mil.
3.2
Pcb板材品牌
PCB sheet brand
PCB品牌应为KB
PCB brand should be KB
3.3
Pcb板厚度要求
PCB plate
thickness
requirements
PCB板厚度1.6mm±0.1mm(特殊结构板材要求需确认)
PCB plate thickness 1.6mm ± 0.1mm (special structural sheet
requirements need to be confirmed)
3.4
Pcb板铜箔厚度要
求
PCB plate
copper foil
thickness
requirements
PCB铜箔厚度： 大于25um 。
PCB copper foil thickness: greater than 25 um.
3.5
导电胶按键手感
系数
Conductive glue
button
k>20%。（锅仔片遥控器除外，特殊情况以实际封样为主）
K> 20%. (Except for the pot remover, special cases are the actual
seal)
3.6
碳阻值
Carbon
resistance
用0.5*0.5mm线宽栅型测试板测试，500g正压力，要求碳粒阻值小于
100ohm，碳油阻值小于200ohm。
Tested with 0.5 * 0.5mm wire width, 500g positive pressure,
requiring a carbon grain resistance to less than 100 ohm, and the
carbon resistance is less than 200 ohm.
3.7
壳料原材料
Shell material
ABS+≤10%的水口料
ABS + ≤ 10% water port
4、检验内容及要求 Test content and requirements
4.1 电气性能要求 Electrical performance requirements
NO
项目
project
测试要求
Testing requirements
4.1.1
遥控器的红外光
峰值辐照度
Remote control
of infrared
light peak
irradiance
在自然光或荧光灯200±50lx的环境照度下遥控器所用电源电压为额定工作电压条件下,
用红外光峰值辐照度计进行测量。在遥控器发射点与峰值辐照度计受光点的水平垂直轴
线距离0.5m处,按压遥控器各按键发射红外光信号。直线IR Power≥40uW/c㎡，左右水
平30°，IR Power≥20uW/c㎡.
Under the ambient illuminance of natural light or fluorescent
light 200 ± 50LX, the power supply voltage used in the remote
control is rated at a rated operating voltage, and the
measurement is performed with an infrared light peak irradiance
meter. At the horizontal vertical axis distance of 0.5 m in the