Product Specs

4
□文件新增 Addition of Document ■文件變更 Alteration of Document □文件作廢 Revocation of Document
Subject: Doc. No.: Rev: 2
UMC-STD31LF Product Specification Page 34 of 54
本資料為啟碁科技股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成其他形式使用。
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC.
Form No.: 2-JT-00022-03_001
UMC-STD31LF Product Specification
34
UMC-STD31LF complies IPC/JEDEC J-STD-020 Standard MSL 3
4.7 ESD
It strongly recommends Developer to place ESD suppression components on the interconnection signal
traces between NAD bottom pads and the application board for preventing NAD being suffered ESD events
with the voltage strength over the requirement defined in the table as below
Specification/Requirements
Contact Discharge
Human Body Model(HBM)
2000 Voltages
Charge Device Model(CDM)
500 Voltages
4.8 Packaging
Tape and reel information
A simplified sketch of UMC-STD31LF tape carrier is shown in figures below, including the proper part
orientation, key dimensions, and maximum number of devices per reel