Product Specs

4
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Subject: Doc. No.: Rev: 0.6
UMC-STD31BPN Product Specification Page 7 of 55
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Form No.: 2-JT-00022-03_001
UMC-STD31BPN Product Specification
7
1.3.5 Power output interface
Interface
Description
VEMC_PMU
1 pin. 3.0V output, max current 800mA. For eMMC
VIO33_PMU
1 pin. 3.3V output, max current 100mA. For I/O or sensors
VCN33_PMU
1 pin. 3.3V output, max current 70mA. For Connectivity
VIO18_PMU
1 pin. 1.8V output, max current 200mA. For I/O or sensors
VCN18_PMU
1 pin. 1.8V output, max current 450mA. For Connectivity
VSIM1_PMU
1 pin. 1.8V output, max current 140mA. As SIM1 supply-feed
VSIM2_PMU
1 pin. 1.8V output, max current 140mA.
1.4 Operation condition
tbc: the data will be updated after DVT tests of UMC-MT2731R ROW A-sample is completed
Parameter
Minimum
Typical
Maximum
Unit
Storage Temperature Range
-40
-
85
°C
3GPP RF Performance Temperature Range
-20
-
70
°C
Operating Temperature Range
-40
-
85
°C
Power Supply Voltage(VSYS)
3.8
4
4.2
V
ESD Voltage(Human Body Model)
-
-
2000
V
ESD Voltage(Charge Device Model)
-
-
500
V
Operation Humidity
0
-
95
%RH
Current Consumption
Sleep(Airplane/Flight/Suspended mode)
-
2.905
mA
GSM standby 1.18 sec
-
3.708
mA
LTE FDD CDRX standby(10-MHz/320-ms)
-
3.559
mA
GSM talk 11-dBm; no DTX, P-GSM
-
162.916
mA
VoLTE FDD(40-ms DRX cycle/0-dBm)
-
255.434
mA
LTE Cat 4(150/50-Mbps, 5-dBm, Band7)
-
348.62
mA
LTE Cat 6(300/50-Mbps,5-dBm, Band7)
-
368
mA
1.5 Mechanical specification
Parameter
Min
Typ.
Max
Unit
Length
36.7
36.8
37.05
mm
Width
41.9
42
42.25
mm
Height(with shielding case)
2.93
3.23
3.53
mm
Weight(with shielding case)
9
10
11
G
Module co-planarity
0
-
100
um