Product Specs

4
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Subject: Doc. No.: Rev: 0.6
UMC-STD31BPN Product Specification Page 44 of 55
本資料為啟碁科技股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成其他形式使用。
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC.
Form No.: 2-JT-00022-03_001
UMC-STD31BPN Product Specification
44
H3
GBE_TXC
TX_CLK(I)
CLK_REF(I)
GTXC(O)
H1
GBE_TXD0
TXD0(O)
TXD0(O)
TXD0(O)
J1
GBE_TXD1
TXD1(O)
TXD1(O)
TXD1(O)
H2
GBE_TXD2
TXD2(O)
TXD2(O)
J3
GBE_TXD3
TXD3(O)
TXD3(O)
H5
EINT130 (GBE_TXER)
TX_ER(O)
J2
TX_CTL (GBE_TXEN)
TX_EN(O)
TX_EN(O)
TX_CTL(O)
L5
GBE_RXC
RX_CLK(I)
CLK_REF(I)
RX_CLK(I)
J6
GBE_RXD0
RXD0(I)
RXDO(I)
RXD0(I)
K4
GBE_RXD1
RXD1(I)
RXD1(I)
RXD1(I)
K6
GBE_RXD2
RXD2(I)
RXD2(I)
L6
GBE_RXD3
RXD3(I)
RXD3(I)
K7
EINT131 (GBE_RXER)
RX_ER(I)
RX_ER(I)
K5
RX_CTL (GBE_RXDV)
RX_DV(I)
CRS_DV(I)
RX_CTL(I)
G5
EINT132 (GBE_COL)
COL(I)
J5
GBE_INTR
INTR/CRS(I)
INTR/CRS(I)
INTR/CRS(I)
J4
GBE_MDC
MDC(O)
MDC(O)
MDC(O)
H4
GBE_MDIO
MDIO(I/O)
MDIO(I/O)
MDIO(I/O)
8.7 MSDC
8.7.1 Layout
The total routing length of eMMC signal traces should be less than 1000-mil and the difference length of
MSDC signals shall be kept within 10-mil on the application board. Developer could use VEMC_PMU and
VIO18_PMU as the power supply of eMMC device
8.7.2 MSDC interface
MSDC0 has the independent power domain and is dedicated for eMMC device on the application board.
Interface
Function
Standard
MSDC0
eMMC
eMMC 5.0
8.8 SIM
8.8.1 Layout
VSIM1_PMU/VSIM2_PMU is the power supply-feed for SIM1/SIM2 on the application board, and able to
be configured as 1.8- or 3.3-Volatge level; the default setting is 1.8-Volatge. Both SIM1_SCLK and
SIM2_SCLK is recommended to be shielded by the grounding
8.9 RF antenna port