Product Specs

4
□文件新增 Addition of Document ■文件變更 Alteration of Document □文件作廢 Revocation of Document
Subject: Doc. No.: Rev: 0.6
UMC-STD31BPN Product Specification Page 32 of 55
本資料為啟碁科技股份有限公司專有之財產，非經書面許可，不准透露或使用本資料，亦不准複印，複製或轉變成其他形式使用。
The information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission from WNC.
Form No.: 2-JT-00022-03_001
UMC-STD31BPN Product Specification
32
4.2 Label information
4.3 NAD land pattern
1.36-MM is the original NAD bottom side copper pad diameter size. It implemented the solder mask to
cover these LGA pads; thus, SMD(Solder Mask Define) round pad diameter is 1.20-MM