Product Info

DWM1001C Datasheet

7 A

PPLICATION

NFORMATION

7.1 Application Board Layout Guidelines

When designing the PCB onto which the DWM1001C will be soldered, the proximity of the DWM1001C on-board

antenna to metal and other non-RF transparent materials needs to considered carefully. Two suggested

placement schemes are shown below.

For best RF performance, ground copper should be flooded in all areas of the application board, except

in the areas marked “Keep-Out Area”, where there should be no metal either side, above or below (e.g.

do not place battery under antenna).

The two placement schemes in Figure 4 show an application board with no metallic material in the keep-out area.

The diagram on the right is an application board with the antenna projecting off of the board so that the keep out

area is in free-space. The diagram on the left shows an application board which does not have the module in free

space but has the pcb copper removed on either side (and behind) the module antenna.

(Note: the rectangular area above the shield on the module is the antenna area)

It is also important to note that the ground plane on the application board affects the DWM1001C antenna

radiation pattern. There must be a minimum spacing of 10 mm (d) without metal either side of the module

antenna.

Application Board

d d

Keep-

Out

Area

Keep

Out

Area

Figure 4: DWM1001C Application Board Keep-Out Areas