Specifications
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Wireless Connectivity Guide Texas Instruments 4Q 2014
Sub-1 GHz
CC1100E
Integrated solution provides low cost
and high performance
The CC110E is a highly integrated,
multi-channel RF transceiver designed
for low-power wireless applications in
the 470-MHz and 950-MHz ISM bands.
Key features
• Sub-1GHzFSK/GFSK/MSK/
ASK/OOK RF Transceiver
• 1.2to500-kBauddatarate
• Low-power,lowsystemcost
• Sleepcurrent:–200nA
• 90-µsPLLlocktime:–240µsfrom
sleeptoRX/TX
• On-chipsupportforsyncword
detection, address check, flexible
packet length and automatic CRC
checking
• Separate64-ByteRXandTXdata
FIFOs (enable burst mode data
transmission)
• Suitableforsystemstargeting
Japanese ARIB STD-T96 and
Chinese short range device regula-
tions at 470–510 MHz
Benefits
• Fastdevelopmenttimeandlow
system cost
• Flexibleoptimizationofrangepower
• Enablesuseofinexpensive
microcontroller
• Enablesadaptivechannelselec-
tion with increased robustness and
coexistence of the wireless link
• Smallsizesolution
Applications
• Automaticmeterreading
• ActiveRFID
Integrated Multi-Channel RF Transceiver
CC1100E
Get samples, datasheets, evaluation modules and application notes at:
www.ti.com/sc/device/CC1100E
CC1100E application circuit.
General Characteristics
Parameter
(433/868 MHz, 3.0 V, 25°C) Min Typ Max Unit Condition
Operating conditions:
Frequencyrange 470 — 510 MHz
950 — 960 MHz
Operatingtemperaturerange –40 — +85 ºC
Operatingsupplyvoltage 1.8 — 3.6 V
Datarate(programmable) 1.2 — 500 kBaud
Outputpower(programmable) –30 — +12 dBm
Receiversensitivity,1.2kBaud — –112 — dBm 1%packeterrorrate
Power consumption
CurrentconsumptionRX — 16 — mA Inputwellabovesensitivitylimit
CurrentconsumptionTX
—
—
15.0
30.0
—
—
mA
mA
0dBm
12dBm
Currentconsumption,powerdown — <1 — µA
20 19 18 17 16
15
L131
L121
L122
L123
C121
C131
R171
1.8 V to 3.6 V Power Supply
C124
C122
C123
1
2
3
4
5
67 8910
14
13
12
11
C51
SCLK
SO (GD01)
GD02
DVDD
DCOUPL
AVDD
AVDD
RF_N
RF_P
AVDD
C125
SI
GND
DGUARD
RBIAS
GND
GDO0
CSn
XOSC_Q1
AVDD
XOSC_Q2
Antenna
(50 Ω)
XTAL
(Optional)
(Optional)
C81
C101
CC1100E
DIE ATTACH PAD:
Digital Interface
For quicker integration
use a Chip Balun from
our third party developer.