Datasheet

78 Chapter 1
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Personal Computer System Components
One of the downsides to TECs is the likelihood of condensation because of the sub-
ambient temperatures these devices produce. Closed-cell foams can be used to guard
against damage from condensation.
Phase-Change Cooling
There is one new type of PC cooling that is just starting to be seen: phase-change cooling.
With this type of cooling, the cooling effect from the change of a liquid to a gas is used to
cool the inside of a PC. It is a very expensive method of cooling, but it does work. Most
often, external air-conditioner-like pumps, coils, and evaporators cool the coolant, which is
sent, ice cold, to the heat sink blocks on the processor and chipset. Think of it as a water-
cooling system that chills the water below room temperature. It is possible to get CPU
temps in the range of –4°F (–20°C). Normal CPU temperatures hover between 104°F and
122°F (40°C and 50°C).
The major drawback to this method is that in higher-humidity conditions, condensation
can be a problem. The moisture from the air condenses on the heat sink and can run off
onto and under the processor, thus shorting out the electronics. Designers of phase-change
cooling systems offer solutions to help ensure this isn’t a problem. Products in the form
of foam; silicone adhesive; and greaseless, non-curing adhesives are available to seal the
surface and perimeter of the processor. Additionally, manufacturers sell gaskets and shims
that correspond to specific processors, all designed to protect your delicate and expensive
components from damage.
Liquid Nitrogen and Helium Cooling
In the interest of completeness, there is a novel approach to super-cooling processors that
is ill-advised under all but the most extreme circumstances. By filling a vessel placed over
the component to be cooled with a liquid form of nitrogen or, for an even more intense
effect, helium, temperatures from –100 to –240 degrees Celsius can be achieved. The
results are short-lived and only useful in overclocking with a view to setting records.
The processor is not likely to survive the incident, due to the internal stress from the
extreme temperature changes.
Summary
In this chapter, we took a tour of the system components of a PC. You learned about some
of the elements that make up a PC. You’ll learn about others in the next two chapters. In
addition, we discussed common peripheral ports and cables and their appearance. Finally,
you learned about the various methods used for cooling a PC. You also saw what many of
these items look like and how they function.
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