Hardware Description

Wi-linktech Communication Technologies (Shanghai) Co.,Ltd
2019-06-01 www.wi-linktech.com 9 / 10
021-20255077
6. Storage
1. Calculated shelf life in sealed bag： 12 months at <40℃ and <90% relative
humidity(RH).
2. After bag is opened , devices that will be subjected to reflow solder or other high
temperature process must be:
1). Check the humidity card :Normal at ≦ 30%RH. If :30%~40%(pink) or
greater than 40%(red),labeling module has moisture absorption. Module require
bake before mounting.
2). Mounted within 168 hours of factory conditions <30℃/60%RH.OR
3). Module apart packing after 168 hours，need to bake before SMT, to remove
the module hygroscopic.
3. If baking is required ,devices may be baked for 8 hours at 125℃. After baking,
put proper amount of desiccant to seal packages.
4. Module vacuum packing 600PCS per bag.
Note: Product handling, storage, processing process must follow the J-STD-033 IPC/JEDEC
7 Software introduction
WLT8761M is a bluetooth dual mode module with embedded Bluetopia™ protocol stack, support
for all Bluetooth profiles and BLE profiles. Such as SPP, SPPLE, HFP, MAP, PXP, A2DP, ANP, HID,
AVRCP…
UART interface is used for data transmission and log information printing. Host MCU can use
AT+Command set to control WLT8761M module through UART interface. For detail commands
please refer to WLT8761M module SW application documents.