Hardware Description

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3. Module should be placed on the edge of motherboard, ensure the antenna towards outside.
Please make sure that all layers have no trace or copper under the Antenna region.
5 Recommended Reflow Profile(Number of Times : ≤2 times)
Parameter setting of reflow soldering can refer to the following requirements
：
Figure 5. Reflow profile
Temperature range
Time
Key parameters
Preheat zone(<150℃)
60-120S
Ramp up rate:≤2S
Uniform temperature zone(150-200℃)
60-120S
Ramp up rate:<1S
Recirculation zone(>217℃)
40-60S
Peak:240-250℃
Cooling zone
Ramp down rate:1℃/s≤Slope≤4℃/s
Table 8. Reflow process parameter