Technical data
Table of Figures
Figure 1: Main Blocks in a Wireless System (embedded application).................................... 15
Figure 2: Main Blocks in a Wireless System (external micro-controller) ............................... 16
Figure 3: Wireless CPU® viewed from below ....................................................................... 26
Figure 4: Wireless CPU®, viewed from above (Integrated SIM holder variant) ....................... 26
Figure 5: Antenna pig-tail pads ......................................................................................... 27
Figure 6: Dimensions of the Wireless CPU® (Integrated SIM variant) .................................... 28
Figure 7: Dimensions of the Wireless CPU® (Legacy variant)................................................ 29
Figure 8: Wireless CPU®, viewed from underneath .............................................................. 30
Figure 9: Common level translator circuitry using MAX3001............................................... 36
Figure 10: AREF implementation example for AUXI and AUXO ............................................ 38
Figure 11: Level translator arrangement............................................................................. 41
Figure 12: GR64 Charger Implementation .......................................................................... 44
Figure 13: Typical application for pulse charging a battery................................................. 45
Figure 14: Power On timing for GR64001........................................................................... 49
Figure 15: Power Off timing for GR64001........................................................................... 51
Figure 16: Auxiliary input connections to the Wireless CPU® .............................................. 54
Figure 17: Auxiliary output connections to the Wireless CPU® ............................................ 55
Figure 18: Microphone input connections to the Wireless CPU®.......................................... 56
Figure 19: EAR output connections to the Wireless CPU®.................................................... 57
Figure 20: PCM audio path................................................................................................. 58
Figure 21: 13-bit GSM voice embedded in 16-bit PCM Frame............................................. 59
Figure 22: PCM Frame format for a single transfer ............................................................. 59
Figure 23: PCM Frame format for a continuous transfer...................................................... 60
Figure 24: SERVICE Pin Interface......................................................................................... 70
Figure 25: Recommended circuit for a Buzzer implementation ........................................... 71
Figure 26: Recommended circuit for an LED implementation .............................................. 72
Figure 27: ADC sharing arrangement ................................................................................. 76
Figure 28: Recommended circuitry for a TX_ON implementation ........................................ 80
Figure 29: VRTC connection............................................................................................... 82
Figure 30: RF Antenna Pad Dimensions .............................................................................. 84
Figure 31: Thickness of Wireless CPU® variant without SIM holder...................................... 95
Figure 32: Thickness of Wireless CPU® variant with SIM holder........................................... 95
GR64 Integrators’ Manual
Page: 9/106
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable