Specifications

ManualsBrandsWavecom ManualsComputer equipmentGS64

Revision: 003

Date: January 9, 2009

Reference: WA_DEV_Q64_PTS_001

Product Technical Specification &

Customer Design Guidelines

Q64 Wireless CPU

Summary of content (118 pages)

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Product Technical Specification & Customer Design Guidelines Q64 Wireless CPU® Reference: WA_DEV_Q64_PTS_001 Revision: 003 Date: January 9, 2009
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Q64 Wireless CPU® Product Technical Specification & Customer Design Guidelines Reference: WA_DEV_Q64_PTS_001 Revision: 003 Date: January 9, 2009 Powered by the Wavecom Open AT® Software Suite © Confidential Page: 1 / 116 This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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Product Technical Specification & Customer Design Guidelines Document History Revision Date List of revisions 001 February 6, 2008 Creation 002 July 11, 2008 Updates 003 January 9, 2009 Updates to sections §3.3.1, §3.15.1, §5.1, §7.13 and some minor changes © Confidential Page: 2 / 116 This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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Product Technical Specification & Customer Design Guidelines Overview This document defines and specifies the Q64 Wireless CPU®, available in a GSM/GPRS Class 10 quad-band version. Q64 Wireless CPU® is a variant of Wavecom Wireless Microprocessor® WMP100, which is pin to pin and functionally compatible with Wavecom Wireless CPU® GR64001. © Confidential Page: 3 / 116 This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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Product Technical Specification & Customer Design Guidelines Table of Contents Document History ................................................................................2 Overview ..............................................................................................3 Table of Contents ................................................................................4 Table of Figures ...................................................................................8 Trademarks ...............
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Product Technical Specification & Customer Design Guidelines 3.2.2 3.2.3 Electrical Characteristics ............................................................... 22 Power Supply Pin-out ................................................................... 22 3.3 Power Consumption ............................................................................. 23 3.3.1 Power Consumption without Open AT® Processing ...................... 24 3.3.2 Power Consumption with a Dhrystone Open AT® Application .......
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Product Technical Specification & Customer Design Guidelines 3.14.1 3.14.2 3.14.3 Features........................................................................................ 74 Pin Description.............................................................................. 74 Application.................................................................................... 75 3.15 SERVICE Signal..................................................................................... 79 3.15.1 Features.........
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Product Technical Specification & Customer Design Guidelines Mechanical Specifications .................................................................. 103 5.4 5.4.1 Physical Characteristics .............................................................. 103 5.4.2 Mechanical Drawings ................................................................. 103 6 Connector Peripheral Devices References ...............................105 6.1 General Purpose Connector ..............................................
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Product Technical Specification & Customer Design Guidelines Table of Figures Figure 1 : Functional architecture ...................................................................17 Figure 2: Power supply during burst emission................................................21 Figure 3: I²C Timing diagrams, Master ...........................................................32 Figure 4: I²C bus configuration inside the Wireless CPU® ................................
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Product Technical Specification & Customer Design Guidelines Figure 34: Example of SERVICE pin implementation .......................................80 Figure 35 : Real Time Clock power supply ......................................................81 Figure 36: RTC supplied by a gold capacitor ...................................................82 Figure 37: RTC supplied by a non rechargeable battery ..................................83 Figure 38: RTC supplied by a rechargeable battery cell ..................
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Product Technical Specification & Customer Design Guidelines Trademarks , , ®, inSIM®, “YOU MAKE IT, WE MAKE IT WIRELESS”®, WAVECOM , Wireless Microprocessor®, Wireless CPU®, Open AT® and certain other trademarks and logos appearing on this document, are filed or registered trademarks of Wavecom S.A. in France and/or in other countries. All other company and/or product names mentioned may be filed or registered trademarks of their respective owners.
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Product Technical Specification & Customer Design Guidelines References 1 References 1.1 Reference Documents For more details, several documents are referenced in this specification. The Wavecom documents references herein are provided in the Wavecom documentation package; the general reference documents which are not Wavecom owned are not provided in the documentation package. 1.1.
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Product Technical Specification & Customer Design Guidelines References 1.
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Product Technical Specification & Customer Design Guidelines References Abbreviation Definition FR Full Rate FTA Full Type Approval GND GrouND GPI General Purpose Input GPC General Purpose Connector GPIO General Purpose Input Output GPO General Purpose Output GPRS General Packet Radio Service GPS Global Positioning System GSM Global System for Mobile communications HR Half Rate I/O Input / Output LED Light Emitting Diode LNA Low Noise Amplifier MAX MAXimum MIC MICrophone MIN
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Product Technical Specification & Customer Design Guidelines References Abbreviation Definition RAM Random Access Memory RF Radio Frequency RFI Radio Frequency Interference RHCP Right Hand Circular Polarization RI Ring Indicator RST ReSeT RTC Real Time Clock RTCM Radio Technical Commission for Maritime services RTS Request To Send RX Receive SCL Serial CLock SDA Serial DAta SIM Subscriber Identification Module SMS Short Message Service SPI Serial Peripheral Interface SPL Sound
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Product Technical Specification & Customer Design Guidelines General Description 2 General Description 2.1 General Information The Q64 Wireless CPU® is a self-contained E-GSM/GPRS 900/1800 and 850/1900 quad-band Wireless CPU®, including the characteristics listed in the subsection below: 2.1.1 • • • • 2.1.2 Overall Dimensions Length: 50 mm Width: 33 mm Thickness: 6.9 mm Weight: 11.
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Product Technical Specification & Customer Design Guidelines General Description 2.1.4 • • • • • • • • • • • 2.1.5 • • • 2.1.6 Interfaces Digital section running under 2.8 volts 3V/1V8 SIM interface Power supply Serial links (UART) Analogue audio ADC PCM digital audio USB 2.
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Product Technical Specification & Customer Design Guidelines General Description 2.2 Functional Description The global architecture of Q64 Wireless CPU® is described below: Figure 1 : Functional architecture © Confidential Page: 17 / 116 This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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Product Technical Specification & Customer Design Guidelines General Description 2.2.1 RF Functionalities The Radio Frequency (RF) range complies with the Phase II EGSM 900/DCS 1800 and GSM 850/PCS 1900 recommendation.
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Product Technical Specification & Customer Design Guidelines General Description • Several other Open AT® plug-in softwares are able to run over the Open AT® Operating System. • A “GR plug-in” software that provides software compatibility with GR64 Wireless CPU®, in terms of AT commands and system operation. It is specifically designed for GR64 Wireless CPU® compatibility. © Confidential Page: 19 / 116 This document is the sole and exclusive property of WAVECOM.
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Product Technical Specification & Customer Design Guidelines Interfaces 3 Interfaces 3.1 General Interfaces Every hardware interface of the Q64 can be accessed with the Q64 development kit, or GR64 Tina or UMA Board. The available interfaces are described in the table below: Chapter Name Driven by AT commands Driven by Open AT® 3.6 Main Serial Link X X 3.7 Auxiliary Serial Link X X 3.8 SIM Interface X X 3.9 General Purpose IO X X 3.5 Serial Interface (I2C Bus) 3.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.2 Power Supply 3.2.1 Power Supply Description The power supply is one of the key issues in the design of a GSM terminal. Due to the burst emission mode used in GSM/GPRS, the power supply should deliver high current peaks in a short time. During the peaks, the ripple (Uripp) on the supply voltage must not exceed a certain limit (see Table 1 Power supply voltage “Power Supply Voltage”).
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Product Technical Specification & Customer Design Guidelines Interfaces 3.2.2 Electrical Characteristics Input power supply voltage VCC1,2 VMIN VNOM VMAX IMAX Ripple max (Uripp) 3.2 3.6 4.8 1.8 A 10mV Table 1 Power supply voltage (1): This value must be guaranteed during the burst (with 1.5A Peak in GSM or GPRS mode) (2): Maximum operating Voltage Stationary Wave Ratio (VSWR) 2:1 When powering the WMP100 with a battery, the total impedance (battery + protections + PCB) should be <150 mΩ. 3.2.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.3 Power Consumption Power consumption depends on the configuration. Therefore, the following consumption values are given for each mode, RF band and type of software used (with or without an Open AT® application). Note: The following information is provided assuming a 50 Ω RF output. The following consumption values were obtained by performing measurements on Q64 samples at a temperature of 25° C.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.3.1 Power Consumption without Open AT® Processing The following measurements are relevant when no processing is required by the Open AT® application: Either there is no Open AT® application or the Open AT® application is disabled Power consumption without Open AT® application IMIN INOM IMAX average average average VBATT=4,8V VBATT=3,6V VBATT=3,2V IMAX peak unit 27 19 17 N/A µA Paging 9 (Rx burst occurrence ~2s) 16.4 17.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.3.2 Power Consumption with a Dhrystone Open AT® Application The Open AT® application used is the Dhrystone application. The following consumption results are measured during the Dhrystone application run. The two tables are respectively for the CPU clock programmed at 26MHz and 104MHz.
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Product Technical Specification & Customer Design Guidelines Interfaces Power consumption with Dhrystone Open AT® application@104MHz Operating mode IMIN INOM IMAX average average average VBATT=4,8 VBATT=3,6 VBATT=3,2 V V V Parameters Alarm Mode IMAX peak unit N/A N/A N/A N/A Paging 9 (Rx burst occurrence ~2s) 73 89 96 240 RX mA Paging 2 (Rx burst occurrence ~0,5s) 72 88 96 240 RX mA Paging 9 (Rx burst occurrence ~2s) N/A N/A N/A N/A Paging 2 (Rx burst occurrence ~0,5s) N/A N/A
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Product Technical Specification & Customer Design Guidelines Interfaces 3.3.3 Consumption Waveform Samples The consumption waveforms presented below are for an EGSM900 network configuration without the Open AT® Software Suite running on the Q64. The usual VCC voltage is 3.6V. Four significant operating mode consumption waveforms are described: ¾ Connected Mode (PCL5: Tx power 33dBm) ¾ Slow Idle mode (Paging 9) ¾ Fast idle mode (Paging 9) ¾ Transfer mode (GPRS class 10, gam.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.3.3.2 Slow Idle Mode Current Waveform 3.3.3.3 Fast Idle Mode Current Waveform © Confidential Page: 28 / 116 This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.3.3.4 3.3.4 Transfer Mode Class 10 Current Waveform Recommendations for Less Consumption It is recommended to drive the GPIOs as indicated in the table below, especially when using the quiescent current.
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Product Technical Specification & Customer Design Guidelines Interfaces See chapter 3.4, “Electrical Information for Digital I/O” on page 30 for 2V8-1, 2V8-2, pull-up and open drain voltage characteristics and for Reset state definition. If the LED is not necessary, it is possible to disable it. For further details, refer to document [4] AT Command Interface Guide for Open AT® Firmware v6.5. 3.4 Electrical Information for Digital I/O There are three types of digital I/O on the Q64: 2.
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Product Technical Specification & Customer Design Guidelines Interfaces Open drain outputs type Signal name Parameter BUZZER I/O type Minimum Typ Maximum VOL Open Drain 0.4V IOL Open Drain 100mA Condition Pull-up outputs type Signal name Parameter SDA / GPIO13 and SCL / GPIO14 I/O type Minimum Typ Maximum VIH Pull-up 2V VIL Pull-up 0.8V VOL Pull-up 0.4V IOL Pull-up 3mA Condition SDA and SCL are internally pulled up with each 1 kΩ resistor to voltage 2.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.5 I2C Bus 3.5.1 Features The I2C interface includes a clock signal (SCL) and a data signal (SDA) complying with a 100Kbit/s-standard interface (standard mode: s-mode). 3.5.1.1 Characteristics The I²C bus is always master. The maximum speed transfer range is 400Kbit/s (Fast mode: f-mode). For more information on the bus, see document [7] “I²C Bus Specification”, Version 2.0, Philips Semiconductor 1998. 3.5.1.
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Product Technical Specification & Customer Design Guidelines Interfaces AC characteristics Signal Description SCL-freq I²C clock frequency 100 T-start Hold time START condition 0.6 μs T-stop Setup time STOP condition 0.6 μs T-free Bus free time, STOP to START 1.3 μs T-high High period for clock 0.6 μs T-data-hold Data hold time 0 T-data-setup Data setup time 100 3.5.2 Minimum Typ Maximum Unit 400 0.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.6 Main Serial Link (UART1) A flexible 8-wire serial interface is available, compliant with V24 protocol signaling, but not with V28 (electrical interface) due to a 2.8 volts interface. 3.6.1 Features The maximum baud rate of the UART1 is 921 Kbit/s.
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Product Technical Specification & Customer Design Guidelines Interfaces With the Open AT® Software Suite 1.0 / V2.0 when the UART1 service is run the multiplexed signals are unavailable for other purposes. Likewise, if one or more GPIOs (of this table) are allocated the UART1 service is unavailable. The rising time and falling time of the reception signals (mainly DTM1) must be shorter than 300 ns. Recommendation: The Q64 is designed to operate with all serial interface signals.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.6.3 Application The level shifter must be set at 2.8V compliant with a V28 electrical signal. Figure 5: Example of RS-232 level shifter implementation for UART1 U1 chip also protects the Q64 against ESD at 15KV. (Air Discharge). Recommended components: R1, R2 : 15KΩ C1, C2, C3, C4, C5 : 1uF C6 : 100nF C7 : 6.
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Product Technical Specification & Customer Design Guidelines Interfaces V24/CMOS possible design: Figure 6: Example of V24/CMOS serial link implementation for UART1 The design shown in the figure above is a basic design. However, a more flexible design to access this serial link with all modem signals is shown below: Figure 7: Example of full modem V24/CMOS serial link implementation for UART1 It is recommended to add a 15KΩ pull-up resistor on RI and DCD1 to set high level during reset state.
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Product Technical Specification & Customer Design Guidelines Interfaces The Q64 UART1 is designed to operate with all serial interface signals. It is mandatory to use RTS1 and CTS1 for hardware flow control in order to avoid data corruption during transmission. Warning: If you want to activate Power down mode (Wavecom 32K mode) in your ® Open AT application, you need to connect the DTR1 to a GPIO. Please refer to the document [4] AT Command Interface Guide for Open AT® Firmware v6.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.7 Auxiliary Serial Link (UART2) An auxiliary serial interface (UART2) is available on Q64. This interface may be used to connect a Bluetooth or a GPS chip controlled by an Open AT® Plug-in. 3.7.1 Features Maximum baud rate of the UART2 is 921 Kbit/s.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.7.3 Application The voltage level shifter must be set at 2.8V and compliant with a V28 electrical signal. Figure 8: Example of RS-232 level shifter implementation for UART2 Recommended components: Capacitors C1 : 220nF C2, C3, C4 : 1μF Inductor L1 : 10μH RS-232 Transceiver U1 : LINEAR TECHNOLOGY LTC2802IDE J1 : SUB-D9 female The LTC2802 can be powered by an external regulator at 2.8 V.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.8 SIM Interface The Subscriber Identification Module can be directly connected to the Q64 through this dedicated interface. 3.8.1 Features The SIM interface controls the 1.8V and 3V SIM cards. It is recommended to add Transient Voltage Suppressor diodes (TVS) on the signal connected to the SIM socket in order to prevent any Electrostatic Discharge.
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Product Technical Specification & Customer Design Guidelines Interfaces Electrical Characteristics of SIM interface Parameter Conditions Minim. SIMDAT VIH IIH = ± 20μA SIMDAT VIL IIL = 1mA SIMRST, SIMCLK Source current = 20μA 0.9xSIMVCC SIMDAT VOH Source current = 20μA 0.8xSIMVCC SIMRST, SIMCLK Sink current = Typ Maxim. Unit 0.7xSIMVCC V 0.4 V V VOH SIMDAT, 0.4 V -200μA VOL SIMVCC Voltage Output SIMVCC = 2.9V 2.84 2.9 2.96 V 1.74 1.8 1.86 V 10 mA IVCC= 1mA SIMVCC = 1.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.8.2 Pin Description Signal Pin number I/O I/O type Reset state Description Multiplexed with SIMCLK 19 O 2V9 / 1V8 0 SIM Clock Not mux SIMRST 17 O 2V9 / 1V8 0 SIM Reset Not mux SIMDAT 18 I/O 2V9 / 1V8 Pull up* SIM Data Not mux SIMVCC 15 O 2V9 / 1V8 - SIM Power Supply Not mux SIMDET 16 I 1V8 Pull-up# SIM Card Detect Not mux *SIMDAT pull-up is about 10K Ω #SIMDET pull-up is about 100 K Ω.
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Product Technical Specification & Customer Design Guidelines Interfaces Recommended components: • C1 : 100nF • D1 : ESDA6V1SC6 from ST • D2 : DALC208SC6 from SGS-THOMSON • J1 : ITT CANNON CCM03 series (See chapter 9.2 for more information) The capacitor (C1) placed on the SIMVCC line must not exceed 330 nF.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.9 General Purpose Input/Output The Wireless Microprocessor® provides up to 18 General Purpose I/O. They are used to control any external device such as a LCD, a Keyboard backlight. 3.9.1 Features Reset State: 0 : Set to GND 1: Set to supply 2V8 depending. Pull down: Internal pull down with ~60K resistor. Pull up: Internal pull up with ~60K resistor to supply 1V8 or 2V8 depending on I/O type. Z: High impedance.
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Product Technical Specification & Customer Design Guidelines Interfaces Signal Pin number I/O I/O type Reset state GPIO16 35 I/O 2V8-1 Z NOT MUX GPIO17 42 I/O 2V8-1 1 DFM1 GPIO18 41 I/O 2V8-1 Z DTM1 Multiplexed with *GPIO13 and GPIO14 pull-up are 1K Ω. See chapter 3.4, “Electrical Information for Digital I/O” on page 30 for 2V8-1, 2V8-2, pull-up and open drain voltage characteristics and for Reset state definition.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.10 Analog to Digital Converter Three Analog to Digital Converters inputs are provided by the Q64. Those converters are 10 bits resolution, ranging from 0 to 2V. 3.10.1 Features ADIN1/BAT-TEMP input can be used, typically, to monitor external temperature, useful for safety power off in case of application over heating (for Li-Ion battery). This input can also be used for customer application.
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Product Technical Specification & Customer Design Guidelines Interfaces Figure 10: ADC sharing arrangement GPIO29 inside WMP100 is used to control the selection between ADIN and ADIN4.
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Product Technical Specification & Customer Design Guidelines Interfaces Please refer to the following documents for the details of controlling the ADC access: • [9] • [4] AT Command Interface Guide for Open AT® Firmware v6.5 [5] Q64 software user guide [6] AT Command Manual for GR64 and GS64 Wireless CPU® 3.10.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11 Analogue Audio Interface Two different microphone inputs and two different speaker outputs are supported. Audio 1 (MIC and EAR) is designed for handset type application and auxiliary audio is designed for car-kit type application. The Q64 also includes an echo cancellation feature which allows hands-free function. In some cases, ESD protection must be added on the audio interface lines. 3.11.
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Product Technical Specification & Customer Design Guidelines Interfaces Electrical characteristics of MIC1 Parameters Internal biasing DC Characteristics MIC1+ R2 Z1 MIC1N (MIC1P=Open) 200 Hz
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Product Technical Specification & Customer Design Guidelines Interfaces The AUXI input is a passive network applying –14dB gain followed by the transmit part of the CODEC.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.2 Speaker Features The connection is single-ended on AUXO and is differential on EAR. Using a differential connection to reject common mode noise and TDMA noise is strongly recommended. Moreover in single-ended mode, ½ of the power is lost. When using a single-ended connection, make sure to have a very good ground plane, a very good filtering as well as shielding in order to avoid any disturbance on the audio path.
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Product Technical Specification & Customer Design Guidelines Interfaces Electrical characteristics of EAR Parameters Min Typ Max Unit Biasing voltage EARP and EARN 1.30 Output swing voltage RL=8Ω: AT+VGR=6*; single ended - - 2 Vpp RL=8Ω: AT+VGR=6*; differential - - 4 Vpp single - - 2.
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Product Technical Specification & Customer Design Guidelines Interfaces Electrical characteristics of AUXO Parameters Biasing voltage Through coupling capacitor Output swing voltage RL=2kΩ; ended RL Load resistance AT+VGR=6; Min Typ Max Unit - - - V 1.9 TBC Vpp - - KΩ single- - 2 *The output voltage depends on the output speaker gain set by AT command. Please refer to the document [4] AT Command Interface Guide for Open AT® Firmware v6.5. 3.11.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.4 Application 3.11.4.1 Microphone 3.11.4.1.1 MIC1 Differential Connection Example Figure 13: Example of MIC1 input differential connection with LC filter *:Z1 is from 200Hz to 4kHz. For more characteristics refer to chapter 3.11.1.1.1. Note: Audio quality can be very good without L1, L2, C2, C3, and C4 depending on the design. But if there is EMI perturbation, this filter can reduce the TDMA noise.
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Product Technical Specification & Customer Design Guidelines Interfaces Figure 14: Example of MIC1 input differential connection without LC filter *:Z1 is from 200Hz to 4kHz. For more characteristics refer to the chapter 3.11.1.1.1. The capacitor C1 is highly recommended to eliminate the TDMA noise. C1 must be close to the microphone.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.4.1.2 MIC1 Single-ended Connection Example WMP100 (Inside Q64) 2.1V typ Z1*= 1100O typ L1 C1 53 MIC1P 100nF 54 MIC1N 100nF Audio ADC C2 60 AREF Figure 15: Example of MIC1 input single-ended connection with LC filter *:Z1 is from 200Hz to 4kHz. For more characteristics refer to chapter 3.11.1.1.1. Internal input impedance value becomes 1100 Ω, due to the connection of MIC1N to ground.
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Product Technical Specification & Customer Design Guidelines Interfaces The capacitor C1 is highly recommended to eliminate the TDMA noise. C1 must be close to the microphone. Recommended components: C1: 12pF to 33pF (needs to be tuned depending on the design ) C2: Need to be tuned depending on the design. L1: Need to be tuned depending on the design. 3.11.4.1.
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Product Technical Specification & Customer Design Guidelines Interfaces VREF WMP100 (Inside Q64) R1 Z2*=120k Ohm typ R2 C5 MIC 59 AUXI 60 AREF 100nF Audio ADC C1 Figure 18: Example of AUXI input single-ended connection without LC filter *:Z2 is from 200Hz to 4kHz. For more characteristics refer to the chapter 3.11.1.1.2. Recommended components: R1: 4K7 Ω ( for the bias voltage equal to 2.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.4.2 Speaker 3.11.4.2.1 EAR Differential Connection EARP EARN Figure 19: Example of Speaker differential connection Impedance of the speaker amplifier output in differential mode is: R ≤ 2Ω +/-10 %. The connection between the Q64 pins and the speaker/earpiece must be designed to keep the serial impedance lower than 3 Ω in the differential mode. 3.11.4.2.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.4.2.3 AUXO Connection Typical implementation: Figure 21: Example of AUXO connection An capacitor C1 (4.7 μF < C1 < 47 μF) can be added (optional)(depending on speaker characteristics and output power). A decoupling capacitor C3 is highly recommended to reduce the TDMA noise. C3 must be close to the speaker. The connection between the Q64 pin and the speaker must be designed to keep the serial impedance lower than 1.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.5 Design Recommendation 3.11.5.1 General When speakers and microphones are used outside, it is recommended to add ESD protection as close as possible to the speaker or microphone, connected between the audio lines and a good ground. The microphone connections may be either differential or single-ended in MIC1, but using a differential connection is strongly recommended to reject common mode noise and TDMA noise.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.5.3 Recommended Speaker Characteristics Speakers: Electro-magnetic /10mW Impedance: 8Ω for hands-free (EAR) Impedance: 32Ω for heads kit (AUXO) Sensitivity: 110dB SPL min Receiver frequency response compatible with the GSM specifications. 3.11.5.4 Recommended Filtering Components When designing a GSM application, it is important to select the right audio filtering components.
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Product Technical Specification & Customer Design Guidelines Interfaces The table below shows some examples with different Murata components: Package 0402 Filtered band GSM900 GSM 850/900 DCS/PCS Value 100nH 56pF 15pF Types Inductor Capacitor Capacitor Position Serial Shunt Shunt Manufacturer Murata Murata Murata Rated 150mA 50V 50V Reference LQG15HSR10J02 or LQG15HNR10J02 GRM1555C1H560JZ01 GRM1555C1H150JZ01 or GRM1555C1H150JB01 Package 0603 Filtered band GSM900 GSM 850/900
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Product Technical Specification & Customer Design Guidelines Interfaces 3.11.5.5 Audio Track and PCB Layout Recommendation To avoid TDMA noise, it is recommended to surround the audio tracks by ground: 1mm 0.2mm min Differential Audio line Ground 0.15mm max Ground 1mm Q64 Differential Audio line always in parallel Ground Plane Application board Figure 23: Audio track design Remark: Avoid digital tracks crossing under and over the audio tracks.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.12 PWM / Buzzer Output This output is controlled by a PWM controller and provides a buzzer service. 3.12.1 Features The BUZZER is an open drain one. A buzzer can be directly connected between this output and VCC. The maximum current is 100 mA (PEAK). Electrical characteristics Parameter Condition VOL IPEAK Minimum Maximum Unit Iol = 100mA 0.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.12.3 Application The maximum peak current is 100 mA and the maximum average current is 40 mA. A diode against transient peak voltage must be added as described below. VCC R1 D1 Q64 C1 BUZZER Figure 24: Example of buzzer implementation Where: R1 must be chosen in order to limit the current at IPEAK max and must be adjusted in function of the frequency and the duty cycle used.
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Product Technical Specification & Customer Design Guidelines Interfaces Recommended characteristics for the buzzer: Electro-magnetic Impedance: 7 to 30 Ω Sensitivity: 90 dB SPL min @ 10 cm Current: 60 to 90 mA The BUZZER output can also be used to drive a LED as shown in the Figure below: « BUZZER » BUZZER R1 470 Ω 1 2 VCC D1 Figure 25: Example of LED driven by the BUZZER output R1 value can be set according to the LED (D1) characteristics.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.13 Battery Charging Interface The Q64 Wireless CPU® supports one battery charging circuit, two algorithms and one hardware charging mode (pre-charging) for 3 battery technologies: • Ni-Cd • Ni-Mh (Nickel-Metal Hydride) with algorithm 0 • Li-Ion (Nickel-Cadmium) with algorithm 0 (Lithium-Ion) with algorithm 1 The two algorithms control a switch, which connects the CHG_IN signal to the VCC signal.
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Product Technical Specification & Customer Design Guidelines Interfaces A dedicated ADC input, ADIN1/ BAT-TEMP pin 26, for temperature monitoring (only for Li-Ion battery technologies). To use the charging functionality, three items of hardware are required: ¾ A charger power supply This provides a DC power supply limited to 800mA and with a voltage range according to the battery chosen and the Q64 specification. ¾ A battery The charging functionality must be used with rechargeable batteries only.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.13.3 Li-Ion Charging Algorithm The Li-Ion algorithm provides battery temperature monitoring, which is highly recommended to prevent battery damage during the charging phase. The Li-Ion charger algorithm can be divided in three phases: 1. Constant charge 2. Beginning of pulse charge 3.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.13.4 Controlled Pre-charging Hardware There is another charging mode, Pre-charging mode, which is hardware-controlled and not software-controlled. This mode is only activated when the Wireless CPU® is OFF and when VCC is in the voltage range of 2.8V < VBATT < 3.2V. The power supply charger must be connected to CHG_IN (pin 11). In Pre-charging mode, the battery is charged with a direct current of 50mA.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.14 ON / OFF Signal This input is used to switch ON or OFF the Wireless CPU®. A low level signal must be provided on the pin ON/OFF to switch ON the Wireless CPU®. The voltage of this signal must be maintained at low level during a minimum of 1500ms. This signal can be left at high level until switched off. To power OFF the Wireless CPU®, the steps depends on whether the Q64 has GR plug-in embedded.
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Product Technical Specification & Customer Design Guidelines Interfaces Figure 29: ON/OFF circuitry inside Q64 3.14.3 Application Figure 30: Example of ON/OFF pin connection 3.14.3.1 Power-ON Whatever the Q64 has embedded GR plug-in or not, once the Wireless CPU® is powered, the application must set the ON/OFF signal to low to start the Wireless CPU® power-ON sequence. The ON/OFF signal must be held low during a minimum delay of Ton/off-hold (Minimum hold delay on the ON/OFF signal) to power-ON.
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Product Technical Specification & Customer Design Guidelines Interfaces Figure 31 : Power-ON sequence (no PIN code activated) The duration of the firmware power-up sequence depends on: • the need to perform a recovery sequence if the power has been lost during a flash memory modification.
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Product Technical Specification & Customer Design Guidelines Interfaces Proceeding thus by software detection will always prevent the application from deasserting the ON/OFF signal too early. If WIND indicators are disabled or AT commands unavailable or not used, it is still possible to de-assert ON/OFF after a delay long enough (Ton/off-hold) to ensure that the firmware has already completed its power-up initialization.
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Product Technical Specification & Customer Design Guidelines Interfaces Once the "OK" response is issued by the Wireless CPU®, the power supply can be switched off. If GR plug-in is used, a level transition from high level to low level can be acted as a command to de-register from the network and enable the power-OFF sequence. And then the application must set the ON/OFF signal to high level in order to power-OFF the Q64 Wireless CPU® correctly.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.15 SERVICE Signal A specific control pin SERVICE is available to download the Q64 only if the standard XMODEM download, controlled by AT command, is not possible. Specific PC software, provided by Wavecom, is needed to perform this download, especially when downloading for the first time the Flash memory. 3.15.1 Features The SERVICE pin must be connected to the VCC for this specific download.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.15.3 Application 1.5V min VCC max Switch 1 2 SERVICE 3 Figure 34: Example of SERVICE pin implementation 3.16 VREF Output VREF output can be used only for pull-up resistor and can be used as a reference supply. This voltage supply is available when the Q64 is on. 3.16.1 Features Electrical characteristics of the signals Parameter Output voltage VREF Minimum Typ Maximum Unit 2.74 2.8 2.86 V 15 mA Output current 3.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.17 VRTC (Backup Battery) The Q64 Wireless CPU® provides an input / output to connect a Real Time Clock power supply. 3.17.1 Features This pin is used as a back-up power supply for the internal Real Time Clock. The RTC is supported by the Wireless CPU® when VCC is available, but a back-up power supply is needed to save date and hour when the VCC is switched off. Q64 from VCC to RTC VRTC 2.5V regulator 1.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.17.2 Pin Description Signal Pin number I/O I/O type Description VRTC 25 I/O Supply RTC Back-up supply 3.17.3 Application Back-up Power Supply can be provided by: • A super capacitor • A non rechargeable battery • A rechargeable battery cell. 3.17.3.1 Super Capacitor Figure 36: RTC supplied by a gold capacitor Estimated range with 0.47 Farad Gold Cap: 25 minutes minimum.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.17.3.2 Non Rechargeable battery Figure 37: RTC supplied by a non rechargeable battery The diode D1 is mandatory to avoid damaging the non rechargeable battery. Estimated range with 85 mAh battery: 800 h minimum. 3.17.3.3 Rechargeable Battery Cell Figure 38: RTC supplied by a rechargeable battery cell Estimated range with 2 mAh rechargeable battery: ~15 hours.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.18 LED Signal 3.18.1 Features LED is an open collector output from a PNP transistor. The user must implement some form of transistor circuit to drive the LED. When the Q64 is ON, this output is used to indicate the network status. LED status Q64 state VCC status Q64 ON VCC > 3.
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Product Technical Specification & Customer Design Guidelines Interfaces 2s RESET Timing 1 led OFF LED Wireless CPU® Status Undefined Figure 39 : LED state during RESET and Initialization time 3.18.2 Pin Description Signal Pin number I/O I/O type Reset state Description LED 33 O OpenCollector 1* LED driving * This signal is undefined 2 seconds after the reset (initialization time). 3.18.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.19 Digital Audio Interface (PCM) The Digital audio interface (PCM) interface mode allows the connectivity with audio standard peripherals. It can be used, for example, to connect an external audio codec. The programmability of this mode allows to address a large range of audio peripherals. 3.19.
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Product Technical Specification & Customer Design Guidelines Interfaces • PCM-OUT (output): configuration mode. • PCM-IN (input): The frame “data in” is depends on the selected configuration mode. The frame “data out” depends on the selected The PCM-IN signal should be in Hz out of user slot.
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Product Technical Specification & Customer Design Guidelines Interfaces PCM-SYNC TCLK-cycle TSYNC-CLK PCM-CLK TIN-setup TIN-hold PCM-IN SLOT 5 bit 0 SLOT 0 bit 15 SLOT 0 bit 14 SLOT 0 bit 13 SLOT 0 bit 14 SLOT 0 bit 13 TOUTdelay PCM-OUT SLOT 5 bit 0 SLOT 0 bit 15 Figure 42 : PCM Sampling waveform 3.19.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.20 USB 2.0 Interface A 4-wire USB slave interface is available which complies with USB 2.0 protocol signaling. But it is not compliant with the electrical interface, due to the 5V of VUSB. The USB interface signals are VUSB, USBDP, USBDN and GND. 3.20.1 Features ¾ 12Mbit/s full speed transfer rate ¾ 3.3V typ. compatible ¾ USB Soft connect feature ¾ Download feature is not supported by USB ¾ CDC 1.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.20.3 Application A typical schematic is shown below: Figure 43: Example of USB implementation Recommended components: R1: 1MΩ C1, C3 : 100nF C2, C4 : 2.2μF D1 : STF2002-22 from SEMTECH U1 : LP2985AIM 3.3V from NATIONAL SEMICONDUCTOR The regulator used is a 3.3V one. It is supplied through J1 when the USB wire is plugged. The EMI/RFI filter with ESD protection is D1.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.21 RF Interface The Wireless CPU®s antenna connector allows transmission of radio frequency (RF) signals from the Wireless CPU® to an external customer supplied antenna. The connector is a micro-miniature coaxial MMCX through hole-mounted socket.
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Product Technical Specification & Customer Design Guidelines Interfaces 3.21.3 Antenna Specifications The antenna must fulfill the following requirements: • The optimum operating frequency depends on the application.
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Product Technical Specification & Customer Design Guidelines Consumption Measurement Procedure 4 Consumption Measurement Procedure This chapter describes the procedure for consumption measurement which is used to obtain the Wireless CPU® consumption specification. Q64/OASS1.0 consumption specification values are measured for all operating modes available on this product. See the appendix of document [4] AT Command Interface Guide for Open AT® Firmware v6.5.
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Product Technical Specification & Customer Design Guidelines Consumption Measurement Procedure PC 231 mA AX502 4V 66321B 3.6V VBATT supply VBAT supply GND GND CMU200 UART1 link USB SUPPLY UART1 UART2 SIM DevelopmentKit Q64 RF Q64 WCPU Figure 44: Typical hardware configuration The communication tester is a CMU 200 from Rhode & Schwartz. This tester offers all required GSM/GPRS network configurations and allows a wide range of network configurations to be set.
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Product Technical Specification & Customer Design Guidelines Consumption Measurement Procedure 4.1.2 Wireless CPU® Development Kit The Wireless CPU® board used is the Q64 Wireless CPU® Development board. This board can be used to perform consumption measurement with several settings. The Wireless CPU® is only powered by VBATT on the development board. The Development Kit board is powered by the standalone power supply at VBAT.
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Product Technical Specification & Customer Design Guidelines Consumption Measurement Procedure An overview of the Q64 operating modes is given below: ¾ Alarm Mode ¾ Fast Idle Mode ¾ Slow Idle Mode ¾ Fast Standby Mode ¾ Slow Standby Mode ¾ Connected Mode ¾ Transfer Mode class 8 (4Rx/1Tx) (in GPRS mode) ¾ Transfer Mode class 10 (3Rx/2Tx) (in GPRS mode) NOTE: To enter fast standby mode or slow standby mode, the ON/OFF pin must be kept at low level.
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Product Technical Specification & Customer Design Guidelines Consumption Measurement Procedure 4.2.2 Equipment Configuration The communication tester is set according to the Wireless CPU® operating mode. Paging during idle modes, Tx burst power, RF band and GSM/DCS/GPRS may be selected on the communication tester.
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Product Technical Specification & Customer Design Guidelines Consumption Measurement Procedure 4.3 Template This template may be used configurations are available. for consumption measurement, all modes and Three VCC voltages are measured, 3.2V, 3.6V and 4.8V and the minimum/maximum RF transmission power configurations are set and measured.
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Product Technical Specification & Customer Design Guidelines Technical Specifications 5 Technical Specifications 5.
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Product Technical Specification & Customer Design Guidelines Technical Specifications Signal Name Signal Name Pin Number Nominal Mux RTS1 / GPIO9 39 40 CTS1 / GPIO12 DTM1 / GPIO18 41 42 DFM1 / GPIO17 2V8-2 DTM3 43 44 I/O VUSB USBDP 45 PCM Data Input I 2V8-2 PCM-IN USB Power supply input I VUSB PCM Frame Synchro O Microphone Input Positive Description I/O* Voltage Voltage I/O* Description Main RS232 Request To Send I GPIO12 2V8-1 O Main RS232 Clear To Send Main RS23
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Product Technical Specification & Customer Design Guidelines Technical Specifications 5.2 Environmental Specifications Wavecom specifies following temperature range of Q64 product. The Q64 is compliant with following operating class: Conditions Operating / Class A Operating / Class B Storage Temperature range -20 °C to +55°C -30 °C to +75°C -40 °C to +85°C Function Status Classification: Class A: The Q64 will have full function during and after an external influence.
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Product Technical Specification & Customer Design Guidelines Technical Specifications Q64 ENVIRONNEMENTAL CLASSES TYPE OF TEST STANDARDS STORAGE Class 1.2 TRANSPORTATION Class 2.3 Cold IEC 68-2.1 Ab test -25° C 72 h -40° C 72 h -20° C (GSM900) -10° C (GSM1800/1900) 16 h 16h Dry heat IEC 68-2.2 Bb test +70° C 72 h +70° C 72 h +55° C 16 h Change of temperature IEC 68-2.14 Na/Nb test Damp heat cyclic IEC 68-2.
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Product Technical Specification & Customer Design Guidelines Technical Specifications 5.3 Reflow Soldering The Wireless CPU® Q64 does not support any reflow soldering. 5.4 Mechanical Specifications 5.4.1 Physical Characteristics The Q64 has a complete self-contained shield. • Overall dimensions : 50 x 33 x 6.8 mm • Weight : 11.6 g 5.4.2 Mechanical Drawings The next page provides mechanical specifications of the Q64.
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Product Technical Specification & Customer Design Guidelines Technical Specifications Figure 46 : Mechanical drawing © Confidential Page: 104 / 116 This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
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Product Technical Specification & Customer Design Guidelines Connector Peripheral Devices References 6 Connector Peripheral Devices References 6.1 General Purpose Connector The GPC is a 60-pin connector with standard 0.05 in (1.27 mm) pitch device. The matting connector has the following reference: M50-3113042 from HARWIN (see http://www.harwin.com) The stacking height is 4.5 mm. 6.2 SIM Card Reader • ITT CANNON CCM03 series (see http://www.ittcannon.com ) • AMPHENOL C707 series (see http://www.
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Product Technical Specification & Customer Design Guidelines Connector Peripheral Devices References 6.5 Antenna Adaptor The following antenna MMCX to SMA adaptors can be used for a SMA antenna connection in application side. • RADIALL R191398020 (http://www.radiall.com) • Amphenol 242141 SMA Jack/MMCX Plug (http://www.amphenol.com) MMCX MALE STRAIGHT ADAPTER 6.6 Antenna Cable The following 50Ω MMCX to SMA cable reference has been qualified for being plugged on Q64: • OnlineCables.
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Product Technical Specification & Customer Design Guidelines Noises and Design 7 Noises and Design 7.1 Hardware and RF 7.1.1 EMC Recommendations The EMC tests have to be performed as soon as possible on the application to detect any possible problem.
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Product Technical Specification & Customer Design Guidelines Noises and Design • Capacity to deliver high current peaks in a short time (pulsed radio emission). 7.1.3 Layout Requirement Four sets of screws, nuts, washer and standoffs are recommended to hold the Wireless CPU® tightly on the application board. • Nut, 2-56 Hex • Screw, 2-56, 1/2" Length • Stand-offs, 2-56, .156" O.D., 1/4" Length • Washer, 2-56 Lock Inside Tooth Figure 47: Standing screw holes requirement 7.1.
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Product Technical Specification & Customer Design Guidelines Noises and Design 7.3 Operating System Upgrade The Q64 Wireless CPU® Operating System is stored in flash memory and can be easily upgraded.
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Product Technical Specification & Customer Design Guidelines Appendix 8 Appendix 8.1 Standards and Recommendations GSM ETSI, 3GPP, GCF and NAPRD03 recommendations for Phase II. Specification Reference Title 3GPP TS 45.005 v5.5.0 Technical Specification Group GSM/EDGE. Radio (2002-08) Release 5 Access Network; Radio transmission and reception GSM 02.07 V8.0.0 (1999- Digital cellular telecommunications system (Phase 2+); 07) Mobile Stations (MS) features (GSM 02.07 version 8.0.0 Release 1999) GSM 02.60 V8.
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Product Technical Specification & Customer Design Guidelines Appendix Specification Reference 3GPP TS (2002-05) 3GPP TS (2002-09) 04.06 04.08 Title V8.2.1 Technical Specification Group GSM/EDGE Radio Access Network; Mobile Station - Base Station System (MS BSS) interface; Data Link (DL) layer specification (Release 1999) V7.18.
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Product Technical Specification & Customer Design Guidelines Appendix Specification Reference 3GPP TS (2002-06) 46.031 Title V5.0.0 Technical Specification Group Services and System Aspects; Full rate speech; Discontinuous Transmission (DTX) for full rate speech traffic channels (Release 5) 3GPP TS (2002-06) 46.032 V5.0.0 Technical Specification Group Services and System Aspects; Full rate speech; Voice Activity Detector (VAD) for full rate speech traffic channels (Release 5) TS 100 913V8.0.
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Product Technical Specification & Customer Design Guidelines Appendix The Wireless CPU® Q64 connected to a development kit board application is certified to be in accordance with the following Rules and Regulations of the Federal Communications Commission (FCC). Power listed on the Gant is conducted for Part 22 and conducted for Part 24. This device contains EGSM/GPRS Class 10 functions in the 900 and 1800MHz Band, which are not operational in U.S. Territories.
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Product Technical Specification & Customer Design Guidelines Appendix 8.2 Safety Recommendations (For Information Only) IMPORTANT FOR THE EFFICIENT AND SAFE OPERATION OF YOUR GSM APPLICATION BASED ON WMP100 PLEASE READ THIS INFORMATION CAREFULLY 8.2.1 8.2.1.1 RF Safety General Your GSM terminal is based on the GSM standard for cellular technology. The GSM standard is spread all over the world. It covers Europe, Asia and some American and African regions. This is the most used telecommunication standard.
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Product Technical Specification & Customer Design Guidelines Appendix 8.2.1.4 Antenna Care and Replacement Do not use the GSM terminal with a damaged antenna. If skin contact occurs with a damaged antenna, a minor burn may result. Replace a damaged antenna immediately. Consult your manual to see if you may change the antenna yourself. If so, use only a manufacturer-approved antenna. Otherwise, have your antenna repaired by a qualified technician. Use only the supplied or approved antenna.
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Product Technical Specification & Customer Design Guidelines Appendix 8.2.2.5 Aircraft Turn your terminal OFF before boarding any aircraft. • Use it on the ground only with crew permission. • Do not use it in the air. To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA) regulations require you to have permission from a crew member to use your terminal while the aircraft is on the ground.
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WAVECOM S.A. : 3 esplanade du Foncet - 92442 Issy-les-Moulineaux - France - Tel: +33 1 46 29 08 00 - Fax: +33 1 46 29 08 08 Wavecom, Inc: 430 Davis Drive, Suite 300 Research Triangle Park, North Carolina, USA - Tel: +1 919 237 4000 - Fax: +1 919 237 4140 WAVECOM Asia-Pacific: Unit 201-207, 2nd Floor, Bio-Informatics Centre No.