Specifications

7.3. HARDWARE DESIGN
Figure 7.1: Block diagram of uplink module’s hardware interconnect
to have local support for the unit as well as local stock (due to the limited
development period which the final year project offers). Although our first
choice would have been the Wavecom GR64 (due to it using standard 0.2”
IDC board-to-board connector), the only module which was available immediately
which used standard surface-mount connectors was the Telit GM862QUAD-
Python. It has an on-board SIM holder, MMC-X RF connector and support
for Python script execution. It has an op e rating temperature range of -30
◦
C
to +80
◦
C.
The GM862 uses a 0.1” 50pin surface-mount Molex board-board connector
for interfacing. Most of these lines are unused in this application, as they
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