User guide

CM52 Integrators’ Manual
CM52 Integrators’ Manual
WI_DEV_CM52_UGD_001-001
Page 3 of 53
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without prior written agreement.
Ce document est la propriété exclusive de WAVECOM. Il ne peut être communiqué ou divulgué à des tiers sans son autorisation préalable
Table of Contents
1 Introduction to the Integrator’s Manual............................................................ 9
1.1 OVERVIEW ............................................................................................................................... 9
1.2 HOW TO READ THE MANUAL ................................................................................................... 9
1.3 SERVICE AND SUPPORT............................................................................................................ 9
1.3.1 WEB PAGES ......................................................................................................................... 9
1.4 RELATED DOCUMENTS .......................................................................................................... 10
1.5 ABBREVIATIONS..................................................................................................................... 10
2 Integrating the CM52 Wireless CPU
®
............................................................... 11
2.1 OVERVIEW ............................................................................................................................. 11
2.2 MECHANICAL DESCRIPTION ................................................................................................... 11
2.2.1 MECHANICAL DIMENSIONS .......................................................................................... 11
2.2.2 HEAT-SINK REQUIREMENTS ......................................................................................... 16
2.2.3 MOUNTING HOLES ...................................................................................................... 16
2.2.3.1 MOUNTING CONFIGURATION A ................................................................................... 16
2.2.3.2 MOUNTING CONFIGURATION B.................................................................................... 17
2.2.4 RF CONNECTOR MOUNTING CONSIDERATIONS............................................................ 17
2.3 SYSTEM CONNECTOR INTERFACE........................................................................................... 18
2.3.1 MECHANICAL OVERVIEW.............................................................................................. 18
2.3.2 SYSTEM CONNECTOR INTERFACE PINOUT.................................................................... 19
2.3.3 LOGIC LEVELS ............................................................................................................. 21
2.3.3.1 LEAKAGE CURRENT FOR CMOS SIGNALS ...................................................................... 21
2.3.3.2 VALIDITY OF CMOS SIGNALS ....................................................................................... 21
2.4 POWER SUPPLY ...................................................................................................................... 21
2.4.1 POWER SUPPLY INPUT CAPACITANCE ........................................................................... 22
2.4.2 POWER SUPPLY AND GROUND SIGNALS........................................................................ 23
2.4.2.1 POWER SUPPLY SIGNAL PINS ........................................................................................ 23
2.4.2.2 GROUND SIGNAL PINS ................................................................................................. 23