Specifications

Wireless CPU
®
Q24 Series
Environmental Specifications
©Confidential Page: 73 / 83
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged without
prior written agreement.
WM_PGM_Q24NG_PTS_001-005 November 20, 2007
5.2 Reflow Soldering
ve
•
ations
5.4.1 Physical Characteristics
®
lete self-contained shield.
The Wireless CPU
®
Q24 Series do not support any reflow soldering.
5.3 Conformance with ATEX 94/9/CE Directi
To evaluate the conformity of the final product with ATEX 94/9/CE directive the
following datas must be taken into account:
Sum of all capacitors : 93µF
• Sum of all inductances : 11µH
5.4 Mechanical Specific
The Wireless CPU
Q24NG sub-series have a comp
• Dimensions : 58.4 x 32.2 x 3.9 mm external dimensions
(excluding shielding pins)
• Weight : <11 g (12g for Q24 Automotive)
5.4.2
page gives the mechanical specifications of the Wireless CPU
®
Q24
Se
(see following page)
Mechanical Drawings
The following
ries.
Figure 18: Mechanical drawing.