Product data
UJA1167 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet Rev. 2 — 18 April 2014 5 of 60
NXP Semiconductors
UJA1167
Mini high-speed CAN system basis chip with Standby/Sleep modes &
watchdog
5. Pinning information
5.1 Pinning
5.2 Pin description
[1] The exposed die pad at the bottom of the package allows for better heat dissipation and grounding from the
SBC via the printed circuit board. For enhanced thermal and electrical performance, it is recommended to
solder the exposed die pad to GND.
(1) INH in the UJA1167TK; VEXT in the UJA1167TK/VX
Fig 2. Pin configuration diagram
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Table 2. Pin description
Symbol Pin Description
TXD 1 transmit data input
GND 2
[1]
ground
V1 3 5 V microcontroller supply voltage
RXD 4 receive data output; reads out data from the bus lines
RSTN 5 reset input/output
SDO 6 SPI data output
INH 7 high-voltage output for switching external regulators (UJA1167TK)
VEXT 7 sensor supply voltage (UJA1167TK/VX)
SCK 8 SPI clock input
WAKE 9 local wake-up input
BAT 10 battery supply voltage
SDI 11 SPI data input
CANL 12 LOW-level CAN bus line
CANH 13 HIGH-level CAN bus line
SCSN 14 SPI chip select input