Instructions / Assembly
12
Step 2 -
Suboor Considerations
Subfloor Preparation
Subfloors previously covered in vinyl, cork or carpeting: all old
flooring and glues must be removed. If there is bitumen as a damp
proofing layer, it must be covered with a minimum 2” of sand/cement
screed or overboarded with
3
/
8
” Warmup Insulation Boards, taking
care not to puncture the bitumen coating. The screed must be fully
cured and dry before proceeding. If using other damp proofing or
tanking systems, contact the manufacturer for advice.
For optimum performance it is recommended that you use Warmup®
Insulation Boards beneath Warmup DCM-PRO. The insulation will
improve the systems response to heating demand, saving energy and
reducing running costs.
Where expansion joints are present in the subfloor, these must be
preserved up through all covering layers, including insulation where
installed and DCM-PRO.
** The
thinset layer is only required when installing DCM-PRO Fleece membrane. / "
levelling compound is required when installing DCM-PRO Peel and Stick membrane. If the
surface the DCM-PRO Peel and Stick membrane is being applied to is smooth such that a
continuous bond can be made this layer of levelling compound is not required.
Concrete Subfloors
CONCRETE SUBFLOOR
(Recommended)
1 Floor Finish
2 ” Minimum Thinset or "
levelling compound*
3 Warmup DCM-PRO Cable
4 Warmup DCM-PRO Fleece
membrane
5 Thinset layer applied with
¼” x ¼” square notch trowel
or /" levelling compound**
6 Warmup Insulation Board
7 ” Minimum Thinset
8 Subfloor
CONCRETE SUBFLOOR
1 Floor Finish
2
1
/
4
” Minimum Thinset or /"
levelling compound*
3 Warmup DCM-PRO Cable
4 Warmup DCM-PRO Fleece
membrane
5 Thinset layer applied with
¼” x ¼” square notch trowel
or /" levelling compound**
6 Subfloor
5
1
2
3
4
6
7
8
5
6
1
2
3
4
DCM-PRO
*
1
/
4
” Minimum thinset or / " levelling compound layer is measured from the top of the
DCM-PRO membrane. The levelling compound, when used, must be applied as a single layer.
Additional layers of levelling compound must not be added.