Instructions / Assembly
13
** The
thinset layer is only required when installing DCM-PRO Fleece membrane. / "
levelling compound is required when installing DCM-PRO Peel and Stick membrane. If the
surface the DCM-PRO Peel and Stick membrane is being applied to is smooth such that a
continuous bond can be made this layer of levelling compound is not required.
Wood Subfloors
WOOD SUBFLOOR
(Recommended)
1 Floor Finish
2
1
/
4
” Minimum Thinset or /"
levelling compound*
3 Warmup DCM-PRO Cable
4 Warmup DCM-PRO Fleece
membrane
5 Thinset layer applied with
¼” x ¼” square notch trowel
or /" levelling compound**
6 Warmup Insulation Board
7
1
/
4
” Minimum Thinset
8 Floor Deck
9 Joists
10 Insulation
WOOD SUBFLOOR
1 Floor Finish
2
1
/
4
” Minimum Thinset or
levelling compound*
3 Warmup DCM-PRO Cable
4 Warmup DCM-PRO Fleece
membrane
5 Thinset layer applied with
¼” x ¼” square notch trowel
or /" levelling compound**
6 Floor Deck
7 Joists
8 Insulation
Step 2 -
Suboor Considerations
In addition to the general subfloor preparation instructions on
the previous page, wood subfloors should be prepared for tiling in
accordance with local tiling standards such as ANSI A108 series.
5
1
2
3
4
6
7
8
9
10
5
1
2
3
4
6
7
8
*
1
/
4
” Minimum thinset or / " levelling compound layer is measured from the top of the
DCM-PRO membrane. The levelling compound, when used, must be applied as a single layer.
Additional layers of levelling compound must not be added.