Datasheet

1 2 3 4 5
A
B
C
D
SIZE
A4
REV DATE FILE BY
A
B
C
D
E
F
G
APPROVAL: RJ
UNIT: MM
SCALE:
PROJECTION: GENERAL TOLERANCE
.X =
+
/
-
0.2
.XX =
+
/
-
0.15
RoHS Compliant
WERI PART NO: 692 121 330 100
DESCRIPTION: USB 3.0 REVERSE HORIZONTAL TYPE A
WITH OFFSET 1.75 MM
DRAW: JOE
SHEET: 3/3
1,67
1,56
6
1,82
1
2,5
0,11
Stencil
Stencil Thickness: 150 µm
PCB
PCB thickness: 1.6mm
Free volume for solder paste
Pin Volume
Hole
Volume
Theoritical Formula for Through Hole pins
Volume of the stencil aperture = (Hole volume - Pin volume) x 2
or
Volume of solder paste = (Hole volume - Pin volume) x 2
PCB cross section
STENCIL LAYOUT * - COMPONENT VIEW
* NOTE: SEE PCB LAYOUT PAGE 1/3 FOR MISSING DIMENSIONS
Stencil information for Through Hole Reflow soldering