Specifications

58
Connectivity
www.bazoo.eu
Bluetooth
®
PRO BT2.1 USB C2 ctn qty. 5 EDP-No. 26916*
USB Bluetooth
®
Dongle V2.1 EDR Class 2
The extremely compact Vivanco USB dongle is the ultimate product for a quick and easy wireless link
between PCs and Bluetooth® compatible devices such as PDAs, mobile phones and printers etc.
Due to its compact design it can remain in the USB port of the notebook during transport.
- Latest Bluetooth
®
Version V 2.1 with EDR (Enhanced Data Rate)
- Full downward compatibility with V 1.1, V 1.2, V 2.0 + EDR
- True Bluetooth
®
Class 2 product with a range of up to 20 m
- Weltweit einheitlicher 2,4 GHz Funkstandard
- Hohe Datensicherheit durch Verschlüsselung und Authentifizierung
- Worldwide standardized 2.4 GHz radio standard
- High data security through encryption and authentication
- Wireless access to networks / Internet wit
hout c
able via Bluetooth
®
mobile phones or Access Points
- Includes quick guide and extensive manual on CD
- Packaging: blister
System requirements:
- Computer with USB support
- Microsoft
®
Windows
®
2000. XP, Vista, Win 7, Macintosh
®
OS 10.2 and higher
BT2.1 USB C2 EDR ctn qty. 5 EDP-No. 25712*
USB Bluetooth
®
V 2.1 Adapter Class 2
Including Toshiba Bluetooth software to extend the range of functions
Supports stereo m
usic transmission and remote control functions
Others
Operang Systems
USB 2.0
Bluetooth
Version 2.1
Operang Systems
.2
Incl. Driver CD Manual
Easy Pairing
PicoNET
Devices
Enhance Data Rate
3x
EDR
Max. Distance
CLASS2
20m
Operang Systems
Thermal Grease
Temperature Range
-50°C
+240°C
*With the change to the bazoo packaging, this has a new article number
HEAT PASTE ctn qty. 5 EDP-No. 23451*
Thermal Compound , 3 g
Vivanco's HEATPASTE thermal paste is produced using an outstanding nano technology-based
manufacturing technique and thus ideally suited for balancing out any unevenness between CPUs
and heat sinks. The nano grease can also be used on graphic cards for better thermal conductivity
b
etween the GPU (graphic processor unit) and the heat sink.
- High thermal conductivity
- Ideally suited for use on CPUs and GPUs
- Thermal Conductivity 4.5 W/m-K
- Thermal Impedance 0.205° C - in 2/W
- Operation Temperture -50 ~ 240° C
- Net weight: 3 g
- With spatula for spreading the thermal paste
- Silicone Compounds 50 %
- Carbon Compounds 30 %
- Metal Oxide Compounds 20 %
06 PC Connectivity_UK 10_05 PC Multimedia_06 21.08.10 15:00 Seite 58