Specifications
DP83848C
,
DP83848I
DP83848VYB, DP83848YB
www.ti.com
SNLS266E –MAY 2007–REVISED MARCH 2015
5 Specifications
5.1 Absolute Maximum Ratings
(1)(2)
MIN MAX UNIT
Supply Voltage (V
CC
) –0.5 4.2 V
DC Input Voltage (V
IN
) –0.5 V
CC
+ 0.5 V
DC Output Voltage (V
OUT
) –0.5 V
CC
+ 0.5 V
Maximum Die Temperature 121.5 °C
Lead Temperature (TL) (Soldering, 10 sec.) 260 °C
Storage Temperature, T
stg
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
5.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±4000
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification JESD22-C101, all ±1000
pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
5.3 Recommended Operating Conditions
MIN MAX UNIT
Supply voltage (V
CC
) 3.3 V ± 0.3 V
Commercial 0 70
Industrial –40 85
°C
Extended –40 105
Extreme –40 125
Power Dissipation (P
D
) 267 mW
5.4 Thermal Information
DP83848C/I DP83848VYB/YB
THERMAL METRIC
(1)
PT [HLQFP] PTB [LQFP] UNIT
48 PINS 48 PINS
R
θJA
Junction-to-ambient thermal resistance 73.9 40.1
R
θJC(top)
Junction-to-case (top) thermal resistance 30.9 25.5
R
θJB
Junction-to-board thermal resistance 37.2 21
°C/W
ψ
JT
Junction-to-top characterization parameter 2.8 2.7
ψ
JB
Junction-to-board characterization parameter 37 20.9
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A 3.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2007–2015, Texas Instruments Incorporated Specifications 11
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