Specifications

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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

40X (0.25)

40X (0.6)

( ) TYP

VIA

0.2

36X (0.5)

(5.8)

( 4.6)

(R ) TYP0.05

(0.74)

TYP

(1.48)

TYP

(0.74) TYP

(1.48) TYP

WQFN - 0.8 mm max heightRTA0040A

PLASTIC QUAD FLATPACK - NO LEAD

4214989/A 12/2014

SYMM

LAND PATTERN EXAMPLE

SCALE:12X

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

SOLDER MASK DETAILS

NON SOLDER MASK

DEFINED

(PREFERRED)