Specifications

DP83848Q-Q1
www.ti.com SNLS341C –MARCH 2011–REVISED MARCH 2015
7 Power Supply Recommendations
The device Vdd supply pins should be bypassed with low impedance 0.1-μF surface mount capacitors. To
reduce EMI, the capacitors should be places as close as possible to the component Vdd supply pins,
preferably between the supply pins and the vias connecting to the power plane. In some systems it may
be desirable to add 0-Ω resistors in series with supply pins, as the resistor pads provide flexibility if adding
EMI beads becomes necessary to meet system level certification testing requirements. (See Figure 7-1) It
is recommended the PCB have at least one solid ground plane and one solid Vdd plane to provide a low
impedance power source to the component. This also provides a low impedance return path for non-
differential digital MII and clock signals. A 10-μF capacitor should also be placed near the PHY component
for local bulk bypassing between the Vdd and ground planes.
Figure 7-1. Vdd Bypass Layout
Copyright © 2011–2015, Texas Instruments Incorporated Power Supply Recommendations 69
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