Specifications

DP83848Q-Q1
www.ti.com SNLS341C –MARCH 2011–REVISED MARCH 2015
4 Specifications
4.1 Absolute Maximum Ratings
(1)(2)
MIN MAX UNIT
Supply Voltage (V
CC
) –0.5 4.2 V
DC Input Voltage (V
IN
) –0.5 V
CC
+ 0.5 V
DC Output Voltage (V
OUT
) –0.5 V
CC
+ 0.5 V
Maximum Case Temperature for T
A
= 105°C 115 °C
Maximum Die Temperature (T
J
) 150 °C
Lead Temp. (TL) (Soldering, 10 sec.) 260 °C
Storage temperature, T
stg
–65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
4.2 ESD Ratings
VALUE UNIT
Human body model (HBM), per AEC Q100-002
(1)
, (R
ZAP
= 1.5k, C
ZAP
=
V
(ESD)
Electrostatic discharge ±4000 V
100 pF)
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
4.3 Recommended Operating Conditions
MIN MAX UNIT
Supply voltage (V
CC
) 3.3 ± 0.3 V
Ambient Temperature (T
A
) –40 105 °C
Power Dissipation (P
D
) 267 mW
4.4 Thermal Information
DP83848Q-Q1
THERMAL METRIC
(1)
RTA (WQFN) UNIT
40 PINS
R
θJA
Junction-to-ambient thermal resistance 34.4
R
θJC(top)
Junction-to-case (top) thermal resistance 21.1
R
θJB
Junction-to-board thermal resistance 40.5
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 10.5
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 5.5
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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