Specifications

DP83848Q-Q1
SNLS341C –MARCH 2011–REVISED MARCH 2015 www.ti.com
3.9 10 Mb/s and 100 Mb/s PMD Interface
SIGNAL NAME TYPE PIN DESCRIPTION
NO.
TD-, TD+ I/O 14 Differential common driver transmit output (PMD Output Pair). These differential outputs
15 are automatically configured to either 10BASE-T or 100BASE-TX signaling.
IIn Auto-MDIX mode of operation, this pair can be used as the Receive Input pair.
These pins require 3.3V bias for operation.
RD-, RD+ I/O 11 Differential receive input (PMD Input Pair). These differential inputs are automatically
12 configured to accept either 100BASE-TX or 10BASE-T signaling.
In Auto-MDIX mode of operation, this pair can be used as the Transmit Output pair.
These pins require 3.3V bias for operation.
3.10 Special Connections
SIGNAL NAME TYPE PIN NO. DESCRIPTION
RBIAS I 20 Bias Resistor Connection: A 4.87 k Ω 1% resistor should be connected from RBIAS to
GND.
PFBOUT O 19 Power Feedback Output: Parallel caps, 10µF (Tantalum preferred) and 0.1µF, should be
placed close to the PFBOUT. Connect this pin to PFBIN1 (pin 18) and PFBIN2 (pin 37). See
Section 6.2.1.3 for proper placement pin.
PFBIN1 I 16 Power Feedback Input: These pins are fed with power from PFBOUT pin. A small capacitor
PFBIN2 30 of 0.1µF should be connected close to each pin.
Note: Do not supply power to these pins other than from PFBOUT.
RESERVED I/O 8, 9, 10 RESERVED: These pins must be left unconnected.
3.11 Power Supply Pins
SIGNAL NAME PIN NO. DESCRIPTION
IOVDD33 1, 26 I/O 3.3-V Supply
IOGND 40 I/O Ground
DGND 29 Digital Ground
AVDD33 18 Analog 3.3-V Supply
AGND 13, 17 Analog Ground
GNDPAD DAP No connect or connect to Ground
(1)
(1) Die Attach Pad (DAP) provides thermal dissipation. Connection to GND plane recommended.
10 Pin Configuration and Functions Copyright © 2011–2015, Texas Instruments Incorporated
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