Datasheet

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VSMF4720

www.vishay.com

Vishay Semiconductors

Rev. 1.2, 25-Sep-13

Document Number: 81923

For technical questions, contact: emittertechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

High Speed Infrared Emitting Diode, 870 nm,

GaAlAs Double Hetero

DESCRIPTION

VSMF4720 is an infrared, 870 nm emitting diode in GaAlAs

double hetero (DH) technology with high radiant power and

high speed, molded in a PLCC-2 package for surface

mounting (SMD). A 19" chip provides outstanding low

forward voltage and radiant intensity even at 1 A pulse

current.

FEATURES

• Package type: surface mount

• Package form: PLCC-2

• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75

• Peak wavelength: λ

= 870 nm

• High reliability

• High radiant power

• High radiant intensity

• Angle of half intensity: ϕ = ± 60°

• Low forward voltage

• Suitable for high pulse current operation

• High modulation band width: f

= 24 MHz

• Good spectral matching with Si photodetectors

• Floor life: 168 h, MSL 3, acc. J-STD-020

• Lead (Pb)-free reflow soldering

• AEC-Q101 qualified

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

APPLICATIONS

• High speed IR data transmission

• High power emitter for low space applications

• High performance transmissive or reflective sensors

Note

• Test conditions see table “Basic Characteristics”

Note

• MOQ: minimum order quantity

948553

PRODUCT SUMMARY

COMPONENT I

(mW/sr) ϕ (deg) λ

(nm) t

(ns)

VSMF4720 16 ± 60 870 15

ORDERING INFORMATION

ORDERING CODE PACKAGING REMARKS PACKAGE FORM

VSMF4720-GS08 Tape and reel MOQ: 7500 pcs, 1500 pcs/reel PLCC-2

VSMF4720-GS18 Tape and reel MOQ: 8000 pcs, 8000 pcs/reel PLCC-2

Summary of content (6 pages)

PAGE 1
VSMF4720 www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diode, 870 nm, GaAlAs Double Hetero FEATURES • Package type: surface mount • Package form: PLCC-2 • Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.
PAGE 2
VSMF4720 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.
PAGE 3
VSMF4720 www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1.25 Φe rel - Relative Radiant Power Tamb < 50 °C tp/T = 0.01 1000 IF - Forward Current (mA) 0.02 0.05 0.1 0.2 0.5 100 0.01 0.1 1 10 0.75 0.5 0.25 IF = 100 mA 0 820 100 Fig. 3 - Pulse Forward Current vs. Pulse Duration Fig. 6 - Relative Radiant Power vs. Wavelength 0° 1000 10° 20° 100 tp = 100 µs tp/T = 0.001 10 40° 1.0 0.9 50° 0.8 60° 70° 0.
PAGE 4
VSMF4720 www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters 0.9 1.75±0.1 3.5±0.2 0.8 Technical drawings according to DIN specifications A C 2.2 2.8±0.15 Pin identification Dimensions in mm Drawing-No.: 6.541-5067.01-4 Issue: 6; 23.09.13 Ø2.4 3 +0.15 Mounting Pad Layout Area covered with solderresist 4 2.6 (2.8) 1.2 1.6 (1.9) 4 Dimensions: Reflow and vapor phase (wave soldering) DRYPACK SOLDER PROFILE 300 255 °C 240 °C 217 °C 250 Temperature (°C) max.
PAGE 5
VSMF4720 www.vishay.com Vishay Semiconductors TAPE AND REEL PLCC-2 components are packed in antistatic blister tape (DIN IEC (CO) 564) for automatic component insertion. Cavities of blister tape are covered with adhesive tape. 10.0 9.0 120° 4.5 3.5 13.00 12.75 2.5 1.5 Adhesive tape Identification Label: Vishay type group tape code production code quantity Blister tape Component cavity 63.5 60.5 14.4 max. 180 178 94 8665 Fig. 12 - Dimensions of Reel-GS08 94 8670 Fig. 9 - Blister Tape 2.2 2.
PAGE 6
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