Datasheet

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, [e-mail], [e-mail] Revision: 25-Oct-10
Outline Dimensions
Vishay Semiconductors
TO-220AB, TO-220AC
DIMENSIONS FOR TO-220AC in millimeters and inches
Notes
(1)
Dimensioning and tolerancing per ASME Y14.5M-1994
(2)
Lead dimension and finish uncontrolled in L1
(3)
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(4)
Dimension b1, b3 and c1 apply to base metal only
(5)
Controlling dimensions: inches
(6)
Thermal pad contour optional within dimensions E, H1, D2 and E1
(7)
Outline conforms are derived from the actual package outline
SYMBOL
MILLIMETERS INCHES
NOTES SYMBOL
MILLIMETERS INCHES
NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 4.25 4.65 0.167 0.183 E 10.11 10.51 0.398 0.414 3, 6
A1 1.14 1.40 0.045 0.055 E1 8.38 8.89 0.330 0.350 6
A2 2.56 2.92 0.101 0.115 e 2.41 2.67 0.095 0.105
b 0.69 1.01 0.027 0.040 e1 4.88 5.28 0.192 0.208
b1 0.38 0.96 0.015 0.038 4 H1 6.09 6.48 0.240 0.255 6
b2 1.20 1.73 0.047 0.068 L 13.52 14.02 0.532 0.552
b3 1.15 1.73 0.045 0.068 4 L1 3.32 3.82 0.131 0.150 2
c 0.36 0.61 0.014 0.024 L3 1.78 2.13 0.070 0.084
c1 0.36 0.56 0.014 0.022 4 L4 0.76 1.27 0.030 0.050
D 14.85 15.25 0.585 0.600 3 Ø P 3.54 3.73 0.139 0.147
D1 8.38 9.02 0.330 0.355 Q 2.60 3.00 0.102 0.188
D2 12.19 12.88 0.480 0.507 6  90° to 93° 90° to 93°
3
DD
CC
21
Detail B
Detail B
View A - A
D
L1
D
123
CC
2 x b2 2 x b
θ
E1 (6)
b, b2
Base metal
c1 (4)
D2 (6)
H1
Thermal pad
E
b1, b3
Section C - C and D - D
Plating
(4)
c
B
A
A
A1
A
A2
C
Seating plane
(6) H1
C
L1
(2)
A
Q
D1
D
L3
L4
Ø P
(6)
E
e1
0.015 AB
MM
L