Datasheet

VOH1016AB, VOH1016AD, VOH1016AG
www.vishay.com
Vishay Semiconductors
Rev. 1.2, 06-Mar-2019
10
Document Number: 84896
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Reel
Fig. 17 - Tape and Reel Shipping Medium
SOLDER PROFILES
IR Reflow Soldering (JEDEC
®
J-STD-020C compliant)
One time soldering reflow is recommended within the
condition of temperature and time profile shown below. Do
not solder more than three times.
Fig. 18
23012
21 ± 0.8
2.0 ± 0.5
13
+ 0.5
- 0.2
1.8
+ 0.2
- 0
330.0 ± 2
100.0 ± 0.3
16.4
+ 1
- 0
PROFILE ITEM CONDITIONS
Preheat
- Temperature minimum (T
S min.
) 150 °C
- Temperature maximum (T
S max.
) 200 °C
- Time (min. to max.) (t
S
) 90 s ± 30 s
Soldering zone
- Temperature (T
L
) 217 °C
- Time (t
L
) 60 s
Peak temperature (T
p
) 260 °C
Ramp-up rate 3 °C/s max.
Ramp-down rate 3 °C/s to 6 °C/s
0 20406080
1000
10000
25
100
1000
10000
Time (s)
Axis Title
1st line
2nd line
2nd line
Temperarure (°C)
Time (s)
10
100
60 s
t
L
(soldering)
60 s to 120 s
t
S
(preheat)
35 s to 70 s
20 s
T
p
(260 °C)
T
L
(217 °C)
T
S max.
(200 °C)
T
S min.
(150 °C)
Ramp-up
Ramp-down
23016