Datasheet

VLMW712U2U3XV, VLMW712T3U3US, VLMW712T2T3QN
www.vishay.com
Vishay Semiconductors
Rev. 1.1, 05-Apr-12
10
Document Number: 83456
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS/SOLDERING PADS DIMENSIONS in millimeters
SOLDERING PROFILE
Fig. 12 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
BAR CODE PRODUCT LABEL (example)
A. Type of component
B. Manufacturing plant
C. SEL - selection code (bin):
e.g.: DA = code for luminous intensity group
5 = code for color group
D. Batch no.
20070 = year 2007, week 07
PH19 = plant code
E. Total quantity
specications
according to DIN
technical drawings
Drawing-No.: 6.541-5075.01-4
Issue: 3; 23.03.12
Anode marking
Recommended solder pad
Solder resist
Not indicated tolerances ± 0.1
3
5.2
6
0.5
6 7
0.1
0.7
0.7
0.3
0.6
1.6
2.6
2.6
Ø 3.3
5.2
8.2
19
17.5
2.2 1.2
1.5
0.5
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19885
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
max. 2 cycles allowed
255 °C
A
C
B
D
E
20613