Datasheet

VLMW15..
www.vishay.com
Vishay Semiconductors
Rev. 1.5, 12-Jun-15
6
Document Number: 82522
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
SOLDERING PROFILE
Fig. 8 - Vishay Lead (Pb)-free Reflow Soldering Profile
(according to J-STD-020C)
Recommended solder
pad footprint
Technical drawings
according to DIN
specication
Not indicated tolerances ± 0.2
Drawing-No.: 6.541-5096.01-4
Issue: 1; 20.03.12
0.325
0
.
5
0.6
1.55
0
.
7
0
.
3
5
1
0.325
Cathode
19470-6
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
255
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
255 °C
IR Reflow Soldering Profile for lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 2a
max. 2 cycles allowed