Datasheet

VLMU3100
www.vishay.com
Vishay Semiconductors
Rev. 1.2, 26-Jun-17
4
Document Number: 82556
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO 564) for automatic component insertation. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
ARRANGEMENT OF TAPE
FEEDING DIRECTION
DIMENSIONS OF REEL in millimeters
SOLDERING PROFILE
Fig. 7 - Vishay Lead (Pb)-Free Reflow Soldering Profile
(according to J-STD-020C)
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19885
IR Reflow Soldering Profile for Lead (Pb)-Free Soldering
Preconditioning according to JEDEC level 2a
max. 2 cycles allowed
255 °C