Datasheet

VLMG21..
www.vishay.com
Vishay Semiconductors
Rev. 1.5, 28-Nov-14
4
Document Number: 81750
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SOLDERING PROFILE
Fig. 7 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
PACKAGE DIMENSIONS in millimeters
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. ramp up 3 °C/s
max. ramp down 6 °C/s
19885
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
max. 2 cycles allowed
255 °C
Drawing-No.: 6.541-5069.01-4
Issue: 2; 24.11.14
2.2 ± 0.1
2.05 ± 0.1
0.4 ± 0.1
0.1 ± 0.05
0.7 ± 0.1
1.3 ± 0.1
0.9 ± 0.1
1.4 ± 0.1
(1.2)
Cathode mark
Not indicated tolerances ± 0.2
(1.5)
(0.9)
Area not at
technical drawings
according to DIN
specications
Solder resist
Cu.area > 5 mm
2
1
0.8 0.8
2.8
Proposed pad layout
(for reference only)