Datasheet

VLMS1300, VLMO1300, VLMY1300, VLMG1300, VLMTG1300, VLMB1300, VLMB1310
www.vishay.com
Vishay Semiconductors
Rev. 1.3, 30-Apr-13
11
Document Number: 82437
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMB 130., VLMTG 130.
SOLDERING PROFILE
Fig. 20 - Vishay Lead (Pb)-free Reflow Soldering Profile
(according to J-STD-020C)
BAR CODE PRODUCT LABEL (example only)
A. 2D barcode
B. Vishay part number
C. Quantity
D. PTC = selection code (binning)
E. Code of manufacturing plant
F. Batch = date code: year/week/plant code
G. Region code
H. SL = sales location
I. Terminations finishing
K. Lead (Pb)-free symbol
L. Halogen-free symbol
M.RoHS symbol
Recommended solder
pad footprint
0
.
8
0.8
2.3
0.3
0.3
0
.
7
7
0
.
8
0
.
2
8
0
.
3
5
0
.
8
1.6
Cathode
1.1
Not indicated tolerances ± 0.2
Drawing-No.: 6.541-5094.01-4
Issue: 1; 17.10.11
22617
technical drawings
according to DIN
specications
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
255
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
255 °C
19470-5
IR Reflow Soldering Profile for lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 3
max. 2 cycles allowed
A
B
D
C
E FG HI M
L
K