Datasheet

TLMO1000, TLMS1000, TLMY1000
www.vishay.com
Vishay Semiconductors
Rev. 2.0, 27-Sep-13
8
Document Number: 83172
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters
SOLDERING PROFILE
Fig. 19 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
DRY PACKING
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
19426
0
50
100
150
200
250
300
0 50 100 150 200 250 300
Time (s)
Temperature (°C)
255
240 °C
245 °C
max. 260 °C
max. 120 s
max. 100 s
217 °C
max. 30 s
max. Ramp Up 3 °C/s
max. Ramp Down 6 °C/s
255 °C
19470-4
IR Reflow Soldering Profile for lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 2
max. 2 cycles allowed
Aluminum bag
Label
Reel
15973