Datasheet

TFDU4101
www.vishay.com
Vishay Semiconductors
Rev. 1.7, 29-Jun-2018
8
Document Number: 81288
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RECOMMENDED SOLDER PROFILES
Solder Profile for Sn/Pb Soldering
Fig. 4 - Recommended Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU4101 is a lead (Pb)-free transceiver and qualified
for lead (Pb)-free processing. For lead (Pb)-free solder paste
like Sn
(3.0-4.0)
Ag
(0.5-0.9)
Cu, there are two standard reflow
profiles: Ramp-Soak-Spike (RSS) and Ramp-To-Spike
(RTS). The Ramp-Soak-Spike profile was developed
primarily for reflow ovens heated by infrared radiation. With
widespread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown below in
figure 5 and 6 are Vishay's recommended profiles for use
with the TFDU4101 transceivers. For more details please
refer to the application note “SMD Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not recommended.
Ramp-up rates faster than 1.3 °C/s could damage an optical
part because the thermal conductivity is less than compared
to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices wave
soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator. Nevertheless,
we added a chapter to the above mentioned application
note, describing manual soldering and desoldering.
Storage
The storage and drying processes for all Vishay transceivers
(TFDUxxxx and TFBSxxx) are equivalent to MSL4.
The data for the drying procedure is given on labels on the
packing and also in the application note “Taping, Labeling,
Storage and Packing”.
Fig. 5 - Solder Profile, RSS Recommendation
Fig. 6 - RTS Recommendation
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0 50 100 150 200 250 300 350
Time/s
Temperature (°C)
2 to 4 °C/s
2 to 4 °C/s
10 s max. at 230 °C
120 to180 s
160 °C max.
240 °C max.
90 s max.
19535
0
25
50
75
100
125
150
175
200
225
250
275
0 50 100 150 200 250 300 350
Time/s
Temperature/°C
30 s max.
2 °C/s to 3 °C/s
2 °C/s to 4 °C/s
90 s to 120 s
T
≥
217 °C for 70 s max.
T
peak
= 260 °C
70 s max.
T
≥
255 °C for 10 s....30 s
19532
0
40
80
120
160
200
240
280
0 50 100 150 200 250 300
Time/s
Temperature/°C
< 4 °C/s
1.3 °C/s
Time above 217 °C t
≤
70 s
Time above 250 °C t
≤
40 s
Peak temperature T
peak
= 260 °C
< 2 °C/s
T
peak
= 260 °C max.
TFDU Fig3