Datasheet

SiSH472DN
www.vishay.com
Vishay Siliconix
S18-1177-Rev. A, 26-Nov-2018
1
Document Number: 75656
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET
®
power MOSFET
• Optimized for synchronous buck operation
• 100 % R
g
and UIS tested
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
APPLICATIONS
• Notebook CPU core
- High side switch
Notes
a. Base on T
C
= 25 °C
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257
). The PowerPAK
®
1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 81 °C/W
g. Package limited
PRODUCT SUMMARY
V
DS
(V) 30
R
DS(on)
max. () at V
GS
= 10 V 0.0089
R
DS(on)
max. () at V
GS
= 4.5 V 0.0124
Q
g
typ. (nC) 9.8
I
D
(A) 20
a, g
Configuration Single
PowerPAK
®
1212-8SH
Bottom View
D
8
D
7
D
6
D
5
1
S
2
S
3
S
4
G
Top View
1
3.3 mm
3.3 mm
0.9 mm
N-Channel MOSFET
G
D
S
ORDERING INFORMATION
Package PowerPAK 1212-8
Lead (Pb)-free and halogen-free SiSH472DN-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-source voltage V
DS
30
V
Gate-source voltage V
GS
± 20
Continuous drain current (T
J
= 150 °C)
T
C
= 25 °C
I
D
20
g
A
T
C
= 70 °C 20
g
T
A
= 25 °C 15
b, c
T
A
= 70 °C 12
b, c
Pulsed drain current I
DM
50
Continuous source-drain diode current
T
C
= 25 °C
I
S
20
g
T
A
= 25 °C 3.2
b, c
Single pulse avalanche current
L = 0.1 mH
I
AS
21
Avalanche energy E
AS
22 mJ
Maximum power dissipation
T
C
= 25 °C
P
D
28
W
T
C
= 70 °C 18
T
A
= 25 °C 3.5
b, c
T
A
= 70 °C 2.2
b, c
Operating junction and storage temperature range T
J
, T
stg
-55 to +150
°C
Soldering recommendations (peak temperature)
d, e
260
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum junction-to-ambient
b, f
t  10 s R
thJA
29 36
°C/W
Maximum junction-to-case (drain) Steady state R
thJC
3.6 4.5